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    Pattern-edged metal-plane resonance-suppression
    1.
    发明授权
    Pattern-edged metal-plane resonance-suppression 有权

    公开(公告)号：US11277903B2

    公开(公告)日：2022-03-15

    申请号：US16368221

    申请日：2019-03-28

    Applicant: Intel Corporation

    Inventor： Stephen Harvey Hall ,  Khang Choong Yong ,  Ying Ern Ho ,  Yun Rou Lim ,  Wil Choon Song

    IPC: H05K3/02 ,  H05K1/02 ,  G05B19/4097 ,  H05K1/18

    Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

    GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION
    2.
    发明申请
    GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION 审中-公开

    公开(公告)号：US20200209987A1

    公开(公告)日：2020-07-02

    申请号：US16545453

    申请日：2019-08-20

    Applicant: Intel Corporation

    Inventor： Khang Choong Yong ,  Wil Choon Song ,  Howard L. Heck ,  Su Sin Florence Phun

    IPC: G06F3/0362 ,  G06F1/16

    Abstract: Methods and systems may provide for a gyratory sensing system (GSS) for extending the human machine interface (HMI) of an electronic device, particularly small form factor, wearable devices. The gyratory sensing system may include a gyratory sensor and a rotatable element to engage the gyratory sensor. The rotatable element may be sized and configured to be easily manipulated by hand to extend the HMI of the electronic device such that the functions of the HMI may be more accessible. The rotatable element may include one or more rotatable components, such as a body, edge or face of a smart watch, that each may be configured to perform a function upon rotation, such as resetting, selecting, and/or activating a menu item.

    Board to board interconnect
    3.
    发明授权
    Board to board interconnect 有权

    公开(公告)号：US10356902B2

    公开(公告)日：2019-07-16

    申请号：US14757984

    申请日：2015-12-26

    Applicant: INTEL CORPORATION

    Inventor： Chee Ling Wong ,  Wil Choon Song ,  Khang Choong Yong ,  Eng Huat Goh ,  Mohd Muhaiyiddin Bin Abdullah ,  Tin Poay Chuah

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

    Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

    Board to board interconnect
    4.
    发明授权
    Board to board interconnect 有权

    公开(公告)号：US11304299B2

    公开(公告)日：2022-04-12

    申请号：US17008222

    申请日：2020-08-31

    Applicant: Intel Corporation

    Inventor： Chee Ling Wong ,  Wil Choon Song ,  Khang Choong Yong ,  Eng Huat Goh ,  Mohd Muhaiyiddin Bin Abdullah ,  Tin Poay Chuah

    IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

    Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

    GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION
    8.
    发明申请
    GYRATORY SENSING SYSTEM TO ENHANCE WEARABLE DEVICE USER EXPERIENCE VIA HMI EXTENSION 审中-公开
    陀螺传感系统，通过人机界面扩展来增强易用的设备用户体验

    公开(公告)号：US20160370181A1

    公开(公告)日：2016-12-22

    申请号：US14740609

    申请日：2015-06-16

    Applicant: Intel Corporation

    Inventor： Khang Choong Yong ,  Wil Choon Song ,  Howard L. Heck ,  Su Sin Florence Phun

    IPC: G01C19/5712

    CPC classification number: G06F3/0362 ,  G06F1/163

    Abstract: Methods and systems may provide for a gyratory sensing system (GSS) for extending the human machine interface (HMI) of an electronic device, particularly small form factor, wearable devices. The gyratory sensing system may include a gyratory sensor and a rotatable element to engage the gyratory sensor. The rotatable element may be sized and configured to be easily manipulated by hand to extend the HMI of the electronic device such that the functions of the HMI may be more accessible. The rotatable element may include one or more rotatable components, such as a body, edge or face of a smart watch, that each may be configured to perform a function upon rotation, such as resetting, selecting, and/or activating a menu item.

    Abstract translation: 方法和系统可以提供旋转感测系统（GSS），用于扩展电子设备的人机接口（HMI），特别是小型的可穿戴设备。 旋转感测系统可以包括旋转传感器和可旋转元件以接合旋转传感器。 可旋转元件的尺寸和构造可以用手轻松操作以延伸电子设备的HMI，使得HMI的功能可以更易于访问。 可旋转元件可以包括一个或多个可旋转部件，例如智能手表的主体，边缘或表面，每个可以被配置为执行旋转时的功能，例如复位，选择和/或激活菜单项。

    RFI free picture frame metal stiffener
    10.
    发明授权
    RFI free picture frame metal stiffener 有权

    公开(公告)号：US11658127B2

    公开(公告)日：2023-05-23

    申请号：US16454423

    申请日：2019-06-27

    Applicant: Intel Corporation

    Inventor： Eng Huat Goh ,  Jiun Hann Sir ,  Khang Choong Yong ,  Boon Ping Koh ,  Wil Choon Song ,  Min Suet Lim

    IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498

    CPC classification number: H01L23/552 ,  H01L23/49805 ,  H01L23/49816 ,  H01L24/09

    Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.

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