公开(公告)号：WO2014085307A3

公开(公告)日：2014-07-24

申请号：PCT/US2013071628

申请日：2013-11-25

Applicant: INTERMOLECULAR INC

Inventor： ENDO RICHARD R ,  KELEKAR RAJESH

IPC: B05D1/32

CPC classification number: B05D1/005 ,  B05D1/32

Abstract: A spin deposition apparatus includes a deposition mask configured to be arranged proximate a target substrate. The deposition mask includes at least one fluid reservoir offset from a rotational axis of the deposition mask and configured to hold fluid for dispersal on a portion of a surface of the target substrate.

Abstract translation: 旋转沉积设备包括沉积掩模，沉积掩模被配置为布置在目标基板附近。 沉积掩模包括至少一个流体储存器，所述至少一个流体储存器偏离沉积掩模的旋转轴线并被配置为保持流体以分散在目标基板的表面的一部分上。

公开(公告)号：WO2008011329A3

公开(公告)日：2008-03-20

申请号：PCT/US2007073368

申请日：2007-07-12

Applicant: INTERMOLECULAR INC ,  CHIANG TONY P ,  ENDO RICHARD R ,  TSUNG JAMES

Inventor： CHIANG TONY P ,  ENDO RICHARD R ,  TSUNG JAMES

IPC: H01L21/677 ,  C23C16/00

CPC classification number: H01L21/67207 ,  H01L21/67155 ,  H01L21/67225 ,  H01L21/67236

Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.

Abstract translation: 提供了一种用于处理半导体衬底的系统。 该系统包括具有附接到其上的多个模块的主机。 这些模块包括处理模块，存储模块和传输机制。 处理模块可以包括组合处理模块和常规处理模块，诸如表面准备，热处理，蚀刻和沉积模块。 在一个实施例中，至少一个模块存储多个掩码。 多个掩模能够跨越一系列过程和/或将在另一个模块中处理的衬底的多个层的空间位置和几何形状的原位变化。 还提供了用于处理衬底的方法。

公开(公告)号：EP2044623A4

公开(公告)日：2012-10-03

申请号：EP07840397

申请日：2007-07-12

Applicant: INTERMOLECULAR INC

Inventor： CHIANG TONY P ,  ENDO RICHARD R ,  TSUNG JAMES

IPC: H01L21/677 ,  B05D3/06 ,  C23C14/56 ,  C23C16/00 ,  H01L21/20 ,  H01L21/67 ,  H01L27/12 ,  H01L27/32 ,  H01L29/49 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L21/67207 ,  H01L21/67155 ,  H01L21/67225 ,  H01L21/67236