公开(公告)号：WO2009033067A2

公开(公告)日：2009-03-12

申请号：PCT/US2008075459

申请日：2008-09-05

Applicant: INTERMOLECULAR INC ,  ENDO RICK ,  WEINER KURT ,  DE INDRANIL ,  TSUNG JAMES ,  ZHAO MAOSHENG ,  CHENG JEREMY

Inventor： ENDO RICK ,  WEINER KURT ,  DE INDRANIL ,  TSUNG JAMES ,  ZHAO MAOSHENG ,  CHENG JEREMY

IPC: H01L21/20 ,  C23C16/00 ,  H01L21/44

CPC classification number: H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

Abstract: A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

Abstract translation: 提供组合处理室。 组合处理室被配置为隔离可旋转的衬底支撑件的径向部分，该可旋转衬底支撑件又被配置为支撑衬底。 在一个实施例中，腔室包括多个聚集过程头。 在一个实施例中，具有设置在基板支撑件和工艺头之间的基板的插入件限定了用于沉积工艺的约束区域。 基板具有能够将沉积材料接近基板的开口。 通过基板的旋转和开口的移动，基板的多个区域是可访问的，以在单个基板上执行组合处理。

公开(公告)号：EP2186116A4

公开(公告)日：2016-10-26

申请号：EP08799200

申请日：2008-09-05

Applicant: INTERMOLECULAR INC

Inventor： ENDO RICK ,  WEINER KURT ,  DE INDRANIL ,  TSUNG JAMES ,  ZHAO MAOSHENG

IPC: C23C16/458 ,  C23C16/44 ,  C23C16/455

CPC classification number: C23C16/45565 ,  B05B15/0425 ,  B05B15/1296 ,  B05D1/10 ,  B05D1/62 ,  C23C16/4412 ,  C23C16/45589 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/4587 ,  C23C16/50 ,  Y10S438/942

Abstract: The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.

Abstract translation: 本发明的各种实施例提供了衬底和工艺头的相对运动，以在最小空间中访问整个晶片，以在衬底的各个区域上进行组合处理。 这些头使得所述室内的现场隔离处理和使用其的方法被描述。

公开(公告)号：EP2186115A4

公开(公告)日：2014-04-30

申请号：EP08799247

申请日：2008-09-05

Applicant: INTERMOLECULAR INC

Inventor： ENDO RICK ,  WEINER KURT ,  DE INDRANIL ,  TSUNG JAMES ,  ZHAO MAOSHENG ,  CHENG JEREMY

IPC: H01L21/20 ,  B01J19/00 ,  C23C14/04 ,  C23C14/50 ,  C23C14/54 ,  C23C16/455 ,  H01L21/67

CPC classification number: H01L21/32051 ,  B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00659 ,  B01J2219/00745 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/50 ,  C23C14/548 ,  C23C16/45544 ,  H01L21/67005 ,  H01L21/6719

公开(公告)号：WO2008011329A3

公开(公告)日：2008-03-20

申请号：PCT/US2007073368

申请日：2007-07-12

Applicant: INTERMOLECULAR INC ,  CHIANG TONY P ,  ENDO RICHARD R ,  TSUNG JAMES

Inventor： CHIANG TONY P ,  ENDO RICHARD R ,  TSUNG JAMES

IPC: H01L21/677 ,  C23C16/00

CPC classification number: H01L21/67207 ,  H01L21/67155 ,  H01L21/67225 ,  H01L21/67236

Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.

Abstract translation: 提供了一种用于处理半导体衬底的系统。 该系统包括具有附接到其上的多个模块的主机。 这些模块包括处理模块，存储模块和传输机制。 处理模块可以包括组合处理模块和常规处理模块，诸如表面准备，热处理，蚀刻和沉积模块。 在一个实施例中，至少一个模块存储多个掩码。 多个掩模能够跨越一系列过程和/或将在另一个模块中处理的衬底的多个层的空间位置和几何形状的原位变化。 还提供了用于处理衬底的方法。

公开(公告)号：EP2044623A4

公开(公告)日：2012-10-03

申请号：EP07840397

申请日：2007-07-12

Applicant: INTERMOLECULAR INC

Inventor： CHIANG TONY P ,  ENDO RICHARD R ,  TSUNG JAMES

IPC: H01L21/677 ,  B05D3/06 ,  C23C14/56 ,  C23C16/00 ,  H01L21/20 ,  H01L21/67 ,  H01L27/12 ,  H01L27/32 ,  H01L29/49 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L21/67207 ,  H01L21/67155 ,  H01L21/67225 ,  H01L21/67236