公开(公告)号：WO1993016160A1

公开(公告)日：1993-08-19

申请号：PCT/US1993001028

申请日：1993-02-05

Applicant: ISP INVESTMENTS INC.

Inventor： ISP INVESTMENTS INC. ,  FUSIAK, Frank ,  LAMM, Edward, W. ,  ROBERTS, Victor, T.

IPC: C11D03/28

CPC classification number: C11D3/0073 ,  C11D7/263 ,  C11D7/266 ,  C11D7/3272 ,  C11D7/3281 ,  C11D7/5013 ,  C23G5/032 ,  C23G5/036

Abstract: This invention relates to a composition suitable for the removal of an acid or rosin modified flux residue from a printed circuit board, which composition consists essentially of (a) between about 30 and about 80 weight % of a flux solubilizing agent selected from the group of an N- C1 to C6 alkyl pyrrolidone, an N- C1 to C4 alkyl caprolactam, tetramethylurea, dimethylimidiazolidinone and mixtures thereof and (b) between about 20 and about 70 weight % of a non-toxic, water-soluble, corrosion controlling agent which is not the same as (a) and which has a boiling point within about 25 DEG C of said flux solubilizing agent and is selected from the group of C2 to C3 alkylene glycol, tetra-lower alkyl urea, 2 to 4 poly(propylene glycol lower alkyl ether) and 2 to 4 poly(propylene glycol lower alkyl ether acetate). The invention also relates to the process for using said composition in a semi-aqueous defluxing process.

Abstract translation: 本发明涉及一种适用于从印刷电路板除去酸或松香改性助焊剂残留物的组合物，该组合物基本上由以下组成组成：（a）约30至约80重量％的助熔剂增溶剂，其选自 N- C1至C6烷基吡咯烷酮，N-C1至C4烷基己内酰胺，四甲基脲，二甲基亚氨基二唑烷酮及其混合物，和（b）约20至约70重量％的无毒水溶性腐蚀控制剂 与（a）不同，其沸点在所述助熔剂增溶剂的约25℃以内，选自C2至C3亚烷基二醇，四低级烷基脲，2至4聚（丙二醇 低级烷基醚）和2〜4种聚（丙二醇低级烷基醚乙酸酯）。 本发明还涉及在半水性脱焊方法中使用所述组合物的方法。