公开(公告)号：US20240038696A1

公开(公告)日：2024-02-01

申请号：US18225393

申请日：2023-07-24

Applicant: Infineon Technologies AG

Inventor： Hermann Gruber ,  Marcus Nübling ,  Jörg Busch ,  Gerrit Utz

IPC: H01L23/00 ,  H01F27/32 ,  H01L29/66 ,  H01L21/768 ,  H01F27/29

CPC classification number: H01L24/02 ,  H01F27/32 ,  H01L29/66174 ,  H01L21/76829 ,  H01F27/292 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/051

Abstract: An apparatus is provided that includes a substrate. In addition, the apparatus includes a first electrically conductive path arranged in a second layer above the substrate and forming a first connection of the apparatus, and a second electrically conductive pad arranged in the second layer and forming a second connection of the apparatus. An electrically conductive element is arranged in a first layer spaced apart from the second layer. The electrically conductive element forms a first capacitor with either the first pad or the second pad. In addition, a first coil is arranged in the first layer, the second layer, or in both layers. A first end of the first coil is connected to the second pad.