公开(公告)号：US20240017986A1

公开(公告)日：2024-01-18

申请号：US18352444

申请日：2023-07-14

Applicant: Infineon Technologies AG

Inventor： Stefan Barzen ,  Alexander Frey ,  Matthias Friedrich Herrmann ,  Jun Cheng Ooi ,  Hans-Jörg Timme

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/007 ,  B81B3/001 ,  B81C1/00658 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81C2201/0178 ,  B81C2201/0133

Abstract: A MEMS device comprises a first membrane structure having a reinforcement region formed from one piece of the first membrane structure, wherein the reinforcement region has a larger layer thickness than an adjoining region of the first membrane structure. The MEMS device includes an electrode structure, wherein the electrode structure is vertically spaced apart from the first membrane structure.