公开(公告)号：EP3063697A1

公开(公告)日：2016-09-07

申请号：EP14789264.0

申请日：2014-10-24

Applicant: Ingenico Group

Inventor： PAVAGEAU, Stéphane ,  LAMBERT, Xavier

IPC: G06K7/00 ,  H05K1/02 ,  H05K3/12

CPC classification number: H05K1/0284 ,  B23K1/0016 ,  B23K2201/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

Abstract: The technique described relates to a support (38) entering into the fabrication of an electronic device, said support comprising at least one component to be protected (21) and at least one three-dimensional element (34, 35, 36) of height at least equal to the height of an electronic component, said three-dimensional element being disposed laterally opposite said at least one component to be protected (21). According to the technique described, said three-dimensional element (34, 35, 36) is chiefly constituted of a permanent assembling material (51).