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    SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE
    1.
    发明申请
    SYSTEM AND METHOD FOR PROVIDING ACCESS TO AN ENCAPSULATED DEVICE 审中-公开
    用于提供访问封装设备的系统和方法

    公开(公告)号：WO2007136581A1

    公开(公告)日：2007-11-29

    申请号：PCT/US2007/011415

    申请日：2007-05-11

    Applicant: INNOVATIVE MICRO TECHNOLOGY ,  ERLACH, David, M. ,  CARLSON, Gregory, A. ,  THOMPSON, Douglas, L.

    Inventor： ERLACH, David, M. ,  CARLSON, Gregory, A. ,  THOMPSON, Douglas, L.

    IPC: H01L21/00

    CPC classification number: B81C99/004

    Abstract: A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.

    Abstract translation: 描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。 该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本均匀地移除材料，直到孔形成在 在器件晶圆上的特征之上。 通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

    WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE
    3.
    发明申请
    WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH RAISED FEATURE 审中-公开
    使用金属合金与增强特征的水平水平粘结

    公开(公告)号：WO2007078472A1

    公开(公告)日：2007-07-12

    申请号：PCT/US2006/045542

    申请日：2006-11-29

    Applicant: INNOVATIVE MICRO TECHNOLOGY ,  CARLSON, Gregory, A. ,  ERLACH, David, M. ,  PARANJPYE, Alok ,  SUMMERS, Jeffery, F.

    Inventor： CARLSON, Gregory, A. ,  ERLACH, David, M. ,  PARANJPYE, Alok ,  SUMMERS, Jeffery, F.

    IPC: H01L21/00

    CPC classification number: B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate, along with a raised feature formed on the first or the second substrate. At least one of the metal layers may be deposited conformally over the raised feature. The raised feature penetrates the molten material of the first or the second metal layers during formation of the alloy, and produces a spectrum of stoichiometrics for the formation of the desired alloy, as a function of the distance from the raised feature. At some distance from the raised feature, the proper ratio of the first metal to the second metal exists to form an alloy of the preferred stoichiometry.

    Abstract translation: 用于形成封装装置的系统和方法包括密封两个基板之间的绝缘环境的气密密封件，其中之一支撑该装置。 气密密封由两个金属层的合金形成，一个沉积在第一基板上，另一个沉积在第二基板上，以及形成在第一或第二基板上的凸起特征。 金属层中的至少一个可以在凸起特征上保形地沉积。 凸起的特征​​在形成合金期间渗透第一或第二金属层的熔融材料，并且作为与凸起特征的距离的函数产生用于形成所需合金的化学计量谱。 在与凸起特征相距一定距离处，存在第一金属与第二金属的适当比例以形成优选化学计量的合金。

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