公开(公告)号：US20220107472A1

公开(公告)日：2022-04-07

申请号：US17553827

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Alexander KRICHEVSKY ,  Christopher SEIBERT ,  David GOLD ,  Hari MAHALINGAM ,  Jonathan DOYLEND

IPC: G02B6/42 ,  G02B26/10

Abstract: An apparatus includes an aperture disposed through an outer layer, a folding prism adjacent to the aperture, and a multi-mode optical fiber on which the folding prism is disposed. The aperture and the folding prism are insertable into a trench disposed through a waveguide of an edge emitting integrated laser, the aperture is configured to allow a light beam that is emitted by the waveguide, through the aperture, and the folding prism is configured to redirect the allowed light beam to the multi-mode optical fiber.

公开(公告)号：US20250102740A1

公开(公告)日：2025-03-27

申请号：US18373851

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Harel FRISH ,  Hari MAHALINGAM ,  Saeed FATHOLOLOUMI ,  Shane YERKES ,  John HECK ,  Wei QIAN

IPC: G02B6/36

Abstract: A device comprising a silicon substrate and a waveguide on the silicon substrate. A groove is in the substrate, the groove having a sloped rear wall adjacent to the waveguide. A trench is in the substrate, the trench along a second direction generally orthogonal to the first direction across the sloped rear wall, the trench having a vertical wall at an intersection with the sloped rear wall. An optical fiber in the groove with one end of the optical fiber abutting the vertical wall.

公开(公告)号：US20230083222A1

公开(公告)日：2023-03-16

申请号：US17476357

申请日：2021-09-15

Applicant: Intel Corporation

Inventor： Kristof DARMAWIKARTA ,  Benjamin DUONG ,  Srinivas V. PIETAMBARAM ,  Tarek A. IBRAHIM ,  Hari MAHALINGAM ,  Bai NIE

IPC: G02B6/122 ,  G02B6/13

Abstract: Embodiments disclosed herein include electronic packages with photonics integrated circuits (PICs). In an embodiment, an electronic package comprises a glass substrate with a first recess and a second recess. In an embodiment, a PIC is in the first recess. In an embodiment, an optics module is in the second recess, and an optical waveguide is embedded in the glass substrate between the first recess and the second recess. In an embodiment, the optical waveguide optically couples the PIC to the optics module.

公开(公告)号：US20250109998A1

公开(公告)日：2025-04-03

申请号：US18374683

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Vanessa POGUE ,  Hari MAHALINGAM ,  Joshua JOHNSON ,  Jordan DAVIS ,  Ranjeet KUMAR ,  Yen-Jung CHEN ,  Andrew DEVINE ,  Mahtab HAKAMI

IPC: G01L1/24

Abstract: The present disclosure is directed to testing vehicles for optical devices and other semiconductor devices that have insitu sensor units for measuring localized strains, and methods for their use. In an aspect, the optical device may include a photonic integrated circuit device having several components including a laser, an optical amplifier, a waveguides, a modulator, a demodulator, and photodetectors. In another aspect, the sensor unit may include a micro-ring resonator strain sensor, an input grating coupler and an output grating coupler that are coupled to the micro-ring resonator strain sensor, for which the input grating coupler is coupled to a light source and the output grating coupler is coupled to an optical power meter. In yet another aspect, the sensor unit may include a temperature calibration unit having a heater and a temperature diode.

公开(公告)号：US20210210478A1

公开(公告)日：2021-07-08

申请号：US17191615

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Juan DOMINGUEZ ,  Ankur AGRAWAL ,  Kenneth BROWN ,  Yi LI ,  Jing CHEN ,  Aditi MALLIK ,  Xiaoyu HONG ,  Thomas LILJEBERG ,  Andrew C. ALDUINO ,  Ling LIAO ,  David HUI ,  Ren-Kang CHIOU ,  Harinadh POTLURI ,  Hari MAHALINGAM ,  Lobna KAMYAB ,  Sasanka KANUPARTHI ,  Sushrutha Reddy GUJJULA ,  Saeed FATHOLOLOUMI ,  Priyanka DOBRIYAL ,  Boping XIE ,  Abiola AWUJOOLA ,  Vladimir TAMARKIN ,  Keith MEASE ,  Stephen KEELE ,  David SCHWEITZER ,  Brent ROTHERMEL ,  Ning TANG ,  Suresh POTHUKUCHI ,  Srikant NEKKANTY ,  Zhichao ZHANG ,  Kaiyuan ZENG ,  Baikuan WANG ,  Donald TRAN ,  Ravindranath MAHAJAN ,  Baris BICEN ,  Grant SMITH

IPC: H01L25/18 ,  H01L23/473 ,  H01R12/71

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.