公开(公告)号：US12133357B2

公开(公告)日：2024-10-29

申请号：US17123760

申请日：2020-12-16

Applicant: Intel Corporation

Inventor： Jin Yang ,  David Shia ,  Mohanraj Prabhugoud ,  Olaotan Elenitoba-Johnson ,  Craig Jahne ,  Phil Geng

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20418 ,  H05K7/20509

Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US20230137684A1

公开(公告)日：2023-05-04

申请号：US17517348

申请日：2021-11-02

Applicant: Intel Corporation

Inventor： Jin Yang ,  David Shia ,  Jimmy Chuang

IPC: H01L23/427 ,  H01L23/373

Abstract: A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation assembly thermally coupled to at least one integrated circuit device, wherein the heat dissipation assembly includes a heat dissipation device having a boiling enhancement structure attached thereto with a chemically soluble adhesive material; and a thermal interface material between the boiling enhancement structure and the heat dissipation device. Utilizing a chemically soluble adhesive material allows for the boiling enhancement structure to be removed by dissolving the adhesive material, thus allowing for testing, rework, and/or replacement.

公开(公告)号：US12094800B2

公开(公告)日：2024-09-17

申请号：US16721809

申请日：2019-12-19

Applicant: Intel Corporation

Inventor： Zhimin Wan ,  Jin Yang ,  Chia-Pin Chiu ,  Peng Li ,  Deepak Goyal

IPC: H01L23/31 ,  H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/373 ,  H01L23/538

CPC classification number: H01L23/3675 ,  H01L23/3121 ,  H01L23/3185 ,  H01L25/0652 ,  H01L25/18 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/538 ,  H01L24/32 ,  H01L2224/32225

Abstract: Embodiments include semiconductor packages. A semiconductor package includes first and second bottom dies on a package substrate, first top dies on the first bottom die, and second top dies on the second bottom die. The semiconductor package includes thermally conductive slugs on the first bottom die and the second bottom die. The thermally conductive slugs are comprised of a high thermal conductive material. The thermally conductive slugs are positioned directly on outer edges of top surfaces of the first and second bottom dies, inner edges of the top surfaces of the first and second bottom dies, and/or a top surface of the package substrate. The high thermal conductive material of the thermally conductive slugs is comprised of copper, silver, boron nitride, or graphene. The thermally conductive slugs may have two different thicknesses. The semiconductor package may include an active die and/or an integrated heat spreader with the pedestals.

公开(公告)号：US20210216121A1

公开(公告)日：2021-07-15

申请号：US17214230

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  David Rodriguez ,  Jin Yang ,  David Shia ,  Jimmy Chuang ,  Mohanraj Prabhugoud ,  Mark Edmund Sprenger

IPC: G06F1/20 ,  H05K7/20

Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

公开(公告)号：US20190101569A1

公开(公告)日：2019-04-04

申请号：US15720742

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Todd Albertson ,  Jin Yang ,  Donald E. Edenfeld

IPC: G01R1/067 ,  G01R31/26

Abstract: Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

公开(公告)号：US20160299174A1

公开(公告)日：2016-10-13

申请号：US14683742

申请日：2015-04-10

Applicant: INTEL CORPORATION

Inventor： Jin Pan ,  Jin Yang ,  Erkan Acar

IPC: G01R1/073 ,  G01R3/00 ,  G01R1/04

CPC classification number: G01R3/00 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889

Abstract: A microelectronic test device comprising an organic substrate, a probe holder, and an interposer disposed between the organic substrate and the probe holder, wherein the interposer has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the organic substrate. The interposer may effectively decouple the organic substrate from probes in the probe holder, which may substantially reduce or eliminate probe misalignment due to the coefficient of thermal expansion mismatch between the organic substrate and other components of the microelectronic test device and to provide require stiffness to the organic substrate.

Abstract translation: 一种微电子测试装置，包括有机衬底，探针保持器和设置在有机衬底和探针支架之间的插入器，其中插入器的热膨胀系数小于有机衬底的热膨胀系数。 插入器可以有效地将有机衬底与探针保持器中的探针分离，这可以由于有机衬底和微电子测试装置的其它部件之间的热膨胀失配系数而大大减少或消除探针不对准，并且为 有机底物。

公开(公告)号：US20230180434A1

公开(公告)日：2023-06-08

申请号：US17542907

申请日：2021-12-06

Applicant: Intel Corporation

Inventor： David Shia ,  Jin Yang ,  Jimmy Chuang ,  Mohanraj Prabjugoud ,  Michael T. Crocker

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20381

Abstract: A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.

公开(公告)号：US10578647B2

公开(公告)日：2020-03-03

申请号：US15720742

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Todd Albertson ,  Jin Yang ,  Donald E. Edenfeld

IPC: B21J5/08 ,  G01R1/067 ,  G01R31/26 ,  G01R3/00 ,  B21G3/12 ,  B21J5/02

Abstract: Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.

公开(公告)号：US10101367B2

公开(公告)日：2018-10-16

申请号：US14683742

申请日：2015-04-10

Applicant: INTEL CORPORATION

Inventor： Jin Pan ,  Jin Yang ,  Erkan Acar

IPC: G01R3/00 ,  G01R1/073 ,  G01R31/28

Abstract: A microelectronic test device comprising an organic substrate, a probe holder, and an interposer disposed between the organic substrate and the probe holder, wherein the interposer has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the organic substrate. The interposer may effectively decouple the organic substrate from probes in the probe holder, which may substantially reduce or eliminate probe misalignment due to the coefficient of thermal expansion mismatch between the organic substrate and other components of the microelectronic test device and to provide require stiffness to the organic substrate.

公开(公告)号：US09523713B2

公开(公告)日：2016-12-20

申请号：US13903874

申请日：2013-05-28

Applicant: INTEL CORPORATION

Inventor： Youngseok Oh ,  Joe F. Walczyk ,  Jin Yang ,  Pooya Tadayon ,  Ting Zhong

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06783 ,  G01R1/07307 ,  Y10T29/49124

Abstract: Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.

Abstract translation: 本公开的实施例涉及包括液态金属以及相关技术和配置的互连。 各个互连可以将印刷电路板（PCB）的触点电耦合到被测器件（DUT）的触点。 互连可以设置在PCB中或PCB上。 在各种实施例中，互连可以包括限定阱（例如，载体中的开口）的载体，并且液体金属可以设置在阱中。 在一些实施例中，DUT或中间装置的触点的接触可以延伸到井中并直接接触液态金属。 在其他实施例中，柔性电路可以设置在井上以密封井。 柔性电路可以包括用于将液体金属电耦合到DUT的触点的导电焊盘。 可以描述和要求保护其他实施例。