公开(公告)号：US20230420298A1

公开(公告)日：2023-12-28

申请号：US17851999

申请日：2022-06-28

Applicant: Intel Corporation

Inventor： Suddhasattwa Nad ,  Cemil Serdar Geyik ,  Jiwei Sun ,  Jason Steill

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L24/16 ,  H01L2225/06541 ,  H01L2224/13025 ,  H01L2224/0401 ,  H01L25/0655

Abstract: An electronic device comprises a substrate layer comprising a first side and an opposing second side, a through hole passing through the substrate layer between the first side and the second side, a first electrical pathway passing from a first position on the first side of the substrate layer, through a first portion of the through hole, to a first corresponding position on the second side of the substrate layer, a second electrical pathway passing from a second position on the first side of the substrate layer, through a second portion of the through hole, to a corresponding second position on the second side of the substrate layer, and an insulation layer between the first electrical pathway and the second electrical pathway within the through hole, wherein the insulation layer electrically isolates the first electrical pathway from the second electrical pathway.

公开(公告)号：US20220278038A1

公开(公告)日：2022-09-01

申请号：US17742816

申请日：2022-05-12

Applicant: Intel Corporation

Inventor： Ji Yong Park ,  Kyu Oh Lee ,  Yikang Deng ,  Zhichao Zhang ,  Liwei Cheng ,  Andrew James Brown ,  Cheng Xu ,  Jiwei Sun

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

公开(公告)号：US20220037803A1

公开(公告)日：2022-02-03

申请号：US17402916

申请日：2021-08-16

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Jiwei Sun ,  Kemal Aygun

IPC: H01Q21/24 ,  H05K1/02

Abstract: Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a first electronic signal over a first conductive path to a first destination and a second electronic signal over a second conductive path to a second destination. A first slow wave structure comprises the first conductive path and a second slow wave structure comprises the second conductive path. The effective relative permittivity of the first slow wave structure is tuned such that the first electronic signal arrives at its destination at a first time and at a first phase, and the effective relative permittivity of the second slow wave structure is tuned such that the second electronic signal arrives at its destination at a second time and at a second phase.

公开(公告)号：US11121468B2

公开(公告)日：2021-09-14

申请号：US17014081

申请日：2020-09-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US10797394B2

公开(公告)日：2020-10-06

申请号：US16000795

申请日：2018-06-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US20240105577A1

公开(公告)日：2024-03-28

申请号：US17954174

申请日：2022-09-27

Applicant: Intel Corporation

Inventor： Zhenguo Jiang ,  Zhiguo Qian ,  Jiwei Sun ,  Babita Dhayal

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49866

Abstract: Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members are disclosed. An example semiconductor die disclosed herein includes a semiconductor substrate, metal interconnects proximate a first side of the semiconductor substrate, a metal contact proximate a second side of the semiconductor substrate opposite the first side, a first grounding member extending from a grounding interconnect of the metal interconnects to a first distal point in the semiconductor substrate, and a second grounding member extending from the metal contact to a second distal point in the semiconductor substrate, the first distal point closer to the first side of the semiconductor substrate than the second distal point is to the first side of the semiconductor substrate.

公开(公告)号：US20240006289A1

公开(公告)日：2024-01-04

申请号：US17853204

申请日：2022-06-29

Applicant: Intel Corporation

Inventor： Kristof Darmawikarta ,  Kemal Aygun ,  Brandon C. Marin ,  Srinivas Venkata Ramanuja Pietambaram ,  Zhiguo Qian ,  Jiwei Sun

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01L21/768

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L23/552 ,  H01L21/4853 ,  H01L21/76877 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: An electronic device includes a substrate including a core layer having a first surface and a second surface opposite the first surface, and at least one coaxial through-hole extending vertically through the core layer from the first surface to the second surface. The coaxial through-hole includes at least a first through-via that includes electrically conductive material extending through the core layer from the first surface to the second surface, and a conductive layer including the same or different electrically conductive material extending vertically through the core layer from the first surface to the second surface and surrounding the first through-via. The conductive layer is to be connected to a ground voltage and is electrically isolated from the first through-via.

公开(公告)号：US20230103183A1

公开(公告)日：2023-03-30

申请号：US17485045

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Kristof Darmawikarta ,  Srinivas V. Pietambaram ,  Kemal Aygun ,  Telesphor Kamgaing ,  Zhiguo Qian ,  Jiwei Sun

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/48

Abstract: Glass substrates having signal shielding for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer defining a channel and a TGV. The channel at least partially surrounding the TGV. A signal transmission line is provided in the opening and extending through the core layer. An electrically conductive material positioned in the channel. The conductive material to provide electromagnetic shielding to the transmission line.

公开(公告)号：US11380609B2

公开(公告)日：2022-07-05

申请号：US15985348

申请日：2018-05-21

Applicant: Intel Corporation

Inventor： Cheng Xu ,  Jiwei Sun ,  Ji Yong Park ,  Kyu Oh Lee ,  Yikang Deng ,  Zhichao Zhang ,  Liwei Cheng ,  Andrew James Brown

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

公开(公告)号：US20210344116A1

公开(公告)日：2021-11-04

申请号：US17373926

申请日：2021-07-13

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.