公开(公告)号：US12131977B2

公开(公告)日：2024-10-29

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20240063082A1

公开(公告)日：2024-02-22

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T.D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC classification number: H01L23/3677 ,  H05K7/20509 ,  H05K7/1422 ,  G11C5/06

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20230054055A1

公开(公告)日：2023-02-23

申请号：US17975285

申请日：2022-10-27

Applicant: Intel Corporation

Inventor： Marc Milobinski ,  Cong Zhou ,  Ting Li ,  Grant Steen

IPC: H05K7/14 ,  G06F1/16

Abstract: Apparatus, systems, and articles of manufacture are disclosed teaching an apparatus comprising an extender including a body and a tab, the tab coupled to the memory device, a first surface of the tab to be aligned with a second surface of the memory device. Examples disclosed herein further include a bracket to extend across the second surface of the memory device and the first surface of the tab, the bracket coupled to the first surface of the tab via fasteners.

公开(公告)号：US11842943B2

公开(公告)日：2023-12-12

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T. D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Fernando Gonzalez Lenero ,  Carlos Alvizo Flores

IPC: H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC classification number: H01L23/3677 ,  G11C5/06 ,  H05K7/1422 ,  H05K7/20509

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20190387634A1

公开(公告)日：2019-12-19

申请号：US16555372

申请日：2019-08-29

Applicant: Intel Corporation

Inventor： Brian Aspnes ,  Marc Milobinski ,  Mark A. Schmisseur

IPC: H05K5/00 ,  H05K1/18 ,  G06F13/40

Abstract: In one embodiment, a circuit board includes: a plurality of layers including interconnects to carry processor-to-processor signaling between a first processor and a second processor; a first connector adapted to a first peripheral portion of the circuit board to couple to a first contact member of the first processor; and a second connector adapted to a second peripheral portion of the circuit board to couple to a first contact member of the second processor. Other embodiments are described and claimed.