公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20230054055A1

公开(公告)日：2023-02-23

申请号：US17975285

申请日：2022-10-27

Applicant: Intel Corporation

Inventor： Marc Milobinski ,  Cong Zhou ,  Ting Li ,  Grant Steen

IPC: H05K7/14 ,  G06F1/16

Abstract: Apparatus, systems, and articles of manufacture are disclosed teaching an apparatus comprising an extender including a body and a tab, the tab coupled to the memory device, a first surface of the tab to be aligned with a second surface of the memory device. Examples disclosed herein further include a bracket to extend across the second surface of the memory device and the first surface of the tab, the bracket coupled to the first surface of the tab via fasteners.