公开(公告)号：US20210090946A1

公开(公告)日：2021-03-25

申请号：US16578698

申请日：2019-09-23

Applicant: Intel Corporation

Inventor： Darko GRUJICIC ,  Matthew ANDERSON ,  Adrian BAYRAKTAROGLU ,  Roy DITTLER ,  Benjamin DUONG ,  Tarek A. IBRAHIM ,  Rahul N. MANEPALLI ,  Suddhasattwa NAD ,  Rengarajan SHANMUGAM ,  Marcel WALL

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: Embodiments herein relate to systems, apparatuses, and/or processes directed to a package or a manufacturing process flow for creating a package that uses multiple seeding techniques to fill vias in the package. Embodiments include a first layer of copper seeding coupled with a portion of the boundary surface and a second layer of copper seeding coupled with the boundary surface or the first layer of copper seeding, where the first layer of copper seeding and the second layer of copper seeding have a combined thickness along the boundary surface that is greater than a threshold value.

公开(公告)号：US20250112140A1

公开(公告)日：2025-04-03

申请号：US18374609

申请日：2023-09-28

Applicant: Intel Corporation

Inventor： Rahul BHURE ,  Mitchell PAGE ,  Joseph PEOPLES ,  Jieying KONG ,  Nicholas S. HAEHN ,  Astitva TRIPATHI ,  Bainye Francoise ANGOUA ,  Yosef KORNBLUTH ,  Daniel ROSALES-YEOMANS ,  Joshua STACEY ,  Aaditya Anand CANDADAI ,  Yonggang Yong LI ,  Tchefor NDUKUM ,  Scott COATNEY ,  Gang DUAN ,  Jesse JONES ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Dilan SENEVIRATNE ,  Matthew ANDERSON

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/15

Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a core with a first width, and the core comprises a glass layer. In an embodiment, a via is provided through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is provided over the core, where the first layer comprises a second width that is smaller than the first width. In an embodiment, a second layer is provided under the core, where the second layer comprises a third width that is smaller than the first width.