公开(公告)号：US20190206753A1

公开(公告)日：2019-07-04

申请号：US15859483

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Taylor GAINES ,  Mohit MAMODIA ,  Paul START ,  Ken HACKENBERG

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/495 ,  H01L23/29 ,  H01L25/07

CPC classification number: H01L23/3114 ,  H01L23/291 ,  H01L23/49506 ,  H01L23/562 ,  H01L25/074

Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package including a die on a substrate, where the die has a front side surface electrically coupled to the substrate and a backside surface that is opposite from the front side surface. The semiconductor package also has a bicontinuous ceramic composite (BCC) stiffener on the backside surface of the die. The BCC stiffener may include one or more materials, including porous ceramics, polymeric resins, and metals. The BCC stiffener may be directly coupled to the backside surface of the die without an adhesive layer. The BCC stiffener may be disposed on the die to reduce warpage based on the substrate and die. The semiconductor package may have the BCC stiffener formed with the one or more materials using a polymeric resin in a liquid state process and a resin pre-loaded in a ceramic process.