公开(公告)号：US20210345519A1

公开(公告)日：2021-11-04

申请号：US17359405

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Wenbin Tian ,  Yingqiong Bu ,  Yanbing Sun ,  Yang Yao ,  Yuehong Fan ,  Ming Zhang ,  Casey Robert Winkel ,  Jin Yang ,  David Shia ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L23/40

Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.