公开(公告)号：US11808988B2

公开(公告)日：2023-11-07

申请号：US17482482

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Vineeth Abraham ,  Wesley Morgan ,  Eric Moret ,  Paul Diglio ,  Srikant Nekkanty

IPC: G02B6/30 ,  G02B6/42

CPC classification number: G02B6/30 ,  G02B6/4224

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US12174436B2

公开(公告)日：2024-12-24

申请号：US17214035

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Wesley Morgan ,  Srikant Nekkanty ,  Todd R. Coons ,  Gregorio R. Murtagian ,  Xiaoqian Li ,  Nitin Deshpande ,  Divya Pratap

IPC: H04B10/00 ,  G02B6/42

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

公开(公告)号：US20230023483A1

公开(公告)日：2023-01-26

申请号：US17954172

申请日：2022-09-27

Applicant: Intel Corporation

Inventor： Wesley Morgan ,  Feifei Cheng ,  Divya Pratap

IPC: G02B6/38

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enable customization of pigtail lengths of optical connectors. Disclosed is an apparatus comprising an affixed fiber array unit plug including a first optical fiber, a detachable fiber array unit plug including a second optical fiber, the detachable fiber array unit plug to be removably coupled to the affixed fiber array unit plug, and guide pins to interface with both the detachable fiber array unit plug and the affixed fiber array unit plug when coupled together, the guide pins to facilitate alignment of the first optical fiber with the second optical fiber.