公开(公告)号：US20250006645A1

公开(公告)日：2025-01-02

申请号：US18343892

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Xiao Liu ,  Bohan Shan ,  Dingying Xu ,  Gang Duan ,  Haobo Chen ,  Hongxia Feng ,  Jung Kyu Han ,  Xiaoying Guo ,  Zhixin Xie ,  Xiyu Hu ,  Robert Alan May ,  Kristof Kuwawi Darmawikarta ,  Changhua Liu ,  Yosuke Kanaoka

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/15 ,  H01L23/31 ,  H01L23/58 ,  H01L25/10

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first layer of a substrate including a first material having a cavity and a conductive pad at a bottom of the cavity; a first microelectronic component having a first surface and an opposing second surface, the first microelectronic component in the cavity and electrically coupled to the conductive pad at the bottom of the cavity; a second layer of the substrate on the first layer of the substrate, the second layer including a second material that extends into the cavity and on and around the first microelectronic component, wherein the second material includes an organic photoimageable dielectric (PID) or an organic non-photoimageable dielectric (non-PID); and a second microelectronic component electrically coupled to the second surface of the first microelectronic component by conductive pathways through the second layer of the substrate.

公开(公告)号：US20250112138A1

公开(公告)日：2025-04-03

申请号：US18374592

申请日：2023-09-28

Applicant: Intel Corporation

Inventor： Srinivas Pietambaram ,  Gang Duan ,  Sameer Paital ,  Zhixin Xie ,  Rahul Manepalli ,  Jieying Kong

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15

Abstract: Microelectronic integrated circuit package structures include an apparatus having a substrate comprising a layer of glass, the substrate comprising one or more through glass vias (TGVs) extending through the layer of glass. Individual TGVs comprise a TGV sidewall, an organic dielectric layer on the TGV sidewall and a conductive layer on the organic dielectric layer.