公开(公告)号：US20250060392A1

公开(公告)日：2025-02-20

申请号：US18498198

申请日：2023-10-31

Applicant: InvenSense, Inc.

Inventor： Matthew Julian Thompson ,  Joseph Seeger ,  Gavin Ho

IPC: G01P15/08

Abstract: A MEMS device incorporates a first sensor and a second sensor to receive an external excitation and respectively output signals to processing circuitry. The processing circuitry combines the first and second signals to create a third signal, which includes an output from the first sensor when the external excitation is between a first and second frequency relatively close to DC and an output from the second sensor when the external excitation is between a third and fourth frequency at a higher frequency range.

公开(公告)号：US20200039818A1

公开(公告)日：2020-02-06

申请号：US16531990

申请日：2019-08-05

Applicant: InvenSense, Inc.

Inventor： Gavin Ho

IPC: B81B7/00 ,  G01L19/00

Abstract: The performance of a microelectromechanical systems (MEMS) device may be subject to unwanted thermal gradients or nonuniform temperatures. The thermal gradients may be approximated based on voltage measurements taken through bond wires coupled to bond points located on the MEMS device. Thermal gradient measurement may be improved depending on the arrangement of bond wires and/or the material of the bond wires. Sense circuitry that is coupled to the MEMS device may determine corrective actions, such as updating the operation of the MEMS device, that compensate for the adverse effects from the thermal gradients.

公开(公告)号：US11312621B2

公开(公告)日：2022-04-26

申请号：US16531990

申请日：2019-08-05

Applicant: InvenSense, Inc.

Inventor： Gavin Ho

IPC: B81B7/00 ,  G01L19/00

Abstract: The performance of a microelectromechanical systems (MEMS) device may be subject to unwanted thermal gradients or nonuniform temperatures. The thermal gradients may be approximated based on voltage measurements taken through bond wires coupled to bond points located on the MEMS device. Thermal gradient measurement may be improved depending on the arrangement of bond wires and/or the material of the bond wires. Sense circuitry that is coupled to the MEMS device may determine corrective actions, such as updating the operation of the MEMS device, that compensate for the adverse effects from the thermal gradients.