公开(公告)号：EP2778118A2

公开(公告)日：2014-09-17

申请号：EP14250072.7

申请日：2014-04-09

Applicant: InvenSense, Inc.

Inventor： Daneman, Michael Julian ,  Lim, Martin ,  Hung, Li-Wen ,  Lloyd, Stephen

IPC: B81B3/00

CPC classification number: H01L27/1203 ,  B81B3/0056 ,  B81B2201/0221 ,  B81B2203/053

Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one or more metal layers are situated on the top surface of the one or more standoffs. The MEMS device further includes a second substrate including one or more metal layers bonded to the one or more standoffs resulting in an electrical connection between at least a portion of the one or more metal layers of the second substrate and one or more of the at least one electrode on the bottom surface and the at least one electrode on the top surface.

Abstract translation: 微电子机械系统（MEMS）装置包括具有第一表面和第二表面的第一基底，第一基底包括基底层，设置在基底层上的可移动光束，至少一个金属层，以及一个或 更多的间隔设置在基层上，使得一个或多个金属层位于一个或多个支座的顶表面上。 MEMS器件还包括第二衬底，其包括结合到一个或多个支座的一个或多个金属层，导致在第二衬底的一个或多个金属层的至少一部分与至少一个或多个之间的电连接 底表面上的一个电极和顶表面上的至少一个电极。

公开(公告)号：EP2778118B1

公开(公告)日：2016-06-29

申请号：EP14250072.7

申请日：2014-04-09

Applicant: InvenSense, Inc.

Inventor： Daneman, Michael Julian ,  Lim, Martin ,  Hung, Li-Wen ,  Lloyd, Stephen

IPC: B81B3/00

CPC classification number: H01L27/1203 ,  B81B3/0056 ,  B81B2201/0221 ,  B81B2203/053

公开(公告)号：EP2778118A3

公开(公告)日：2014-10-29

申请号：EP14250072.7

申请日：2014-04-09

Applicant: InvenSense, Inc.

Inventor： Daneman, Michael Julian ,  Lim, Martin ,  Hung, Li-Wen ,  Lloyd, Stephen

IPC: B81B3/00

CPC classification number: H01L27/1203 ,  B81B3/0056 ,  B81B2201/0221 ,  B81B2203/053

Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a first substrate with a first surface and a second surface, the first substrate including a base layer, a moveable beam disposed on the base layer, at least one metal layer, and one or more standoffs disposed on the base layer such that one or more metal layers are situated on the top surface of the one or more standoffs. The MEMS device further includes a second substrate including one or more metal layers bonded to the one or more standoffs resulting in an electrical connection between at least a portion of the one or more metal layers of the second substrate and one or more of the at least one electrode on the bottom surface and the at least one electrode on the top surface.