公开(公告)号：US20160218086A1

公开(公告)日：2016-07-28

申请号：US14994963

申请日：2016-01-13

Applicant: J-DEVICES CORPORATION

Inventor： Makoto MODA

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/26145 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49173 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor device is provided including a package substrate, and a plurality of semiconductor chips stacked above the package substrate, at least one of the plurality of semiconductor chips including a step part in a periphery edge part of a rear surface,

Abstract translation: 提供了一种半导体器件，包括封装衬底和堆叠在封装衬底之上的多个半导体芯片，所述多个半导体芯片中的至少一个包括在后表面的周边边缘部分中的台阶部分，