公开(公告)号：US11488886B2

公开(公告)日：2022-11-01

申请号：US16592213

申请日：2019-10-03

Applicant: J-DEVICES CORPORATION

Inventor： Masao Hirobe

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/10 ,  H01L23/04 ,  H01L23/373

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.