公开(公告)号：US20140104953A1

公开(公告)日：2014-04-17

申请号：US14052864

申请日：2013-10-14

Applicant: J-DEVICES CORPORATION

Inventor： Satoru ITAKURA ,  Akio Katsumata ,  Akihiro Umeki ,  Yasushi Shiraishi ,  Junichiro Abe

IPC: G11C16/30 ,  H01L21/66

CPC classification number: G11C16/30 ,  G06F3/00 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C5/063 ,  G11C7/10 ,  G11C7/1069 ,  G11C11/4096 ,  H01L22/10 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/19105

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract translation: 半导体存储装置100包括其底表面上具有BGA端子的控制器封装110; 每个包括多个半导体存储元件并安装在控制器封装上的一个或多个存储器封装120。 所述控制器封装包括在其底表面上具有所述BGA端子的底部基板; 电源IC，安装在底部基板上，用于供给多个电源; 以及控制器，其安装在所述底部基板上并且可由所述电源IC提供的所述多个电源操作。 控制器通过BGA端子提供与外部系统的接口，并控制来自半导体存储元件的读取操作和对半导体存储元件的写入操作。