公开(公告)号：US20170256453A1

公开(公告)日：2017-09-07

申请号：US15409631

申请日：2017-01-19

Applicant: J-DEVICES CORPORATION

Inventor： Takahiro YADA ,  Katsushi YOSHIMITSU

IPC: H01L21/78 ,  H01L21/306 ,  H01L21/56 ,  H01L21/304 ,  H01L25/065 ,  H01L23/31

Abstract: A manufacturing method of a semiconductor package which improves productivity and can manufacture high-quality semiconductor packages is provided. The manufacturing method of a semiconductor package includes arranging a plurality of semiconductor devices at intervals on a first surface side of a support substrate, forming a first insulating resin layer forming wiring connected to each of the plurality of semiconductor devices and embeds the plurality of semiconductor devices, cutting from the first surface side in areas between the plurality of semiconductor devices, forming a first groove portion penetrating the first insulating resin layer and exposing the support substrate, and dividing individual semiconductor packages by forming a resist pattern having openings arranged corresponding to the first groove portion on a second surface on the opposite side of the first surface, etching the openings from the second surface side, and forming a second groove portion on the second surface side