公开(公告)号：US20240042743A1

公开(公告)日：2024-02-08

申请号：US18258874

申请日：2021-10-01

Applicant: JSP CORPORATION

Inventor： Hirotoshi KAKUTA ,  Mikidai FUJITA ,  Naoya KATSUYAMA

IPC: B32B27/06 ,  B32B27/32 ,  B32B27/30 ,  B32B37/15 ,  B32B5/18

CPC classification number: B32B27/065 ,  B32B27/32 ,  B32B27/30 ,  B32B37/153 ,  B32B5/18 ,  B32B2250/02 ,  B32B2264/108 ,  B32B2266/025 ,  B32B2305/022 ,  B32B2307/202 ,  B32B2323/046 ,  B32B2307/7376 ,  B32B2331/04 ,  B32B2333/12 ,  B32B2439/00

Abstract: A polyethylene-based resin multilayer foam sheet may include a polyethylene-based resin foam layer containing a polyethylene-based resin (A) as a base resin, and a conductive layer laminated on at least one side of the foam layer. The conductive layer contains: a mixed resin of one or more polyethylenes (B) of low-density polyethylenes and/or linear low-density polyethylenes and an ethylene-based copolymer (C) having a structural unit derived from ethylene and a structural unit derived from a monomer having a polar group; and conductive carbon. The conductive carbon blended in the conductive layer may be in a range of from 3 to 15 wt. %. The difference, TmB−TmC, between the melting point TmB of the polyethylene (B) and the melting point TmC of the ethylene-based copolymer (C) each contained in the conductive layer may be in a range of from 30 to 80° C.