Abstract:
A probe card for wafer-level testing a plurality of optoelectronic devices on a wafer is provided. The probe card has both electrical and optical functionality. The probe card comprises a plurality of lenslets aligned with the plurality of optoelectronic devices to improve the optical coupling efficiency between each of the plurality of optoelectronic devices and a plurality of optical waveguides located on a probe head.
Abstract:
In accordance with the invention, a tunable, reconfigurable optical add-drop filter comprises a pair of optical waveguides optically coupled by a microring or microdisk resonator wherein the coupling distance between the resonator and at least one of the waveguides is micromechanically controllable. With this arrangement, the degree of coupling can be tuned after fabrication to provide high level extinction of dropped wavelengths and the filter can be dynamically reconfigured. Advantageously, laser radiation is provided to tune the resonant wavelength.
Abstract:
An optical demultiplexing apparatus is capable of spatially separating a multiplexed optical signal into two or more optical wavelength signals thereof. An input multiplexed optical signal present on a first plane is imaged through a color-selective grating plane to a second plane. The color-selective grating has a nonlinear change of diffraction characteristics as a function of incident wavelength to provide substantial spatial separation in the second plane between bands of wavelengths proximate to the two or more optical wavelength signals. In another embodiment, the apparatus uses a polarization-selective grating to spatially separate a polarization-multiplexed optical signal into two substantial spatially separated optical polarization signals. In other embodiments, the optical apparatus may be used as an optical signal multiplexer, splitter, or combiner.
Abstract:
A probe card for wafer-level testing a plurality of optoelectronic devices on a wafer is provided. The probe card has both electrical and optical functionality. The probe card comprises a plurality of lenslets aligned with the plurality of optoelectronic devices to improve the optical coupling efficiency between each of the plurality of optoelectronic devices and a plurality of optical waveguides located on a probe head.
Abstract:
An integrated semiconductor device is formed from two fabricated semiconductor devices each having a substrate by placing an etch-resist on the substrate of the one semiconductor device, by bonding the conductors of one of the fabricated semiconductor devices to the conductors of the other fabricated semiconductor device, flowing an uncured cement (e.g. epoxy) between the etch-resist and the other substrate, allowing the cement to solidify, and removing the substrate from the one of the semiconductor devices. More specifically, a hybrid semiconductor device is formed from a GaAs/AlGaAs multiple quantum well modulator having a substrate and an IC chip having a substrate by placing an etch resist on the modulator substrate, bonding the conductors of the modulator to the conductors of the chip, wicking an uncured epoxy between the modulators and the chip, allowing the epoxy to cure, and removing the substrate from the modulator.
Abstract:
A method for designing an integrated circuit having optical inputs and outputs includes the step of selecting an integrated circuit design which includes at least one circuit cell design for processing electric signals. The circuit cell design has a predetermined number of electric inputs and electric outputs. The integrated circuit design also includes a plurality of layers of metalization for providing electric coupling. After the electronic integrated circuit design is selected, a predetermined number of optical input devices are located on the circuit cell design in a first prearranged orientation. The predetermined number of optical input devices is no greater than the predetermined number of electric inputs to the circuit cell. Also after the electronic circuit design is selected, a predetermined number of optical output devices are located on the circuit cell design in a second prearranged orientation. The predetermined number of optical output devices is no greater than the predetermined number of electric outputs to the circuit cell. At least a topmost layer of metalization is selected for electrically coupling each optical input device to a distinct one of the electric inputs of the circuit cell and for electrically coupling each optical output device to a distinct one of the electric outputs of the circuit cell. Finally, the completed design for the integrated circuit with optical inputs and outputs is recorded in a memory such as an electronic storage medium.
Abstract:
In accordance with the invention, a electromechanical optical modulator comprising an optical membrane, a substrate and Fabry-Perot air gap between them is provided with an improved structure for controlling light transmitted into the substrate. Specifically, an etched and coated cavity is formed in the backwall of the substrate underlying the air gap to receive transmitted light and redirect it onto controllable paths within the substrate. Advantageously the substrate is silicon, and the cavity is produced by anisotropic etching.
Abstract:
An optical assembly for detecting an optical signal from a signal source in systems where the intensity of the optical signal may surpass the operational range of the optical detector being used. The optical assembly includes an optical detector for converting the optical input signal into a corresponding electrical output signal. The optical detector has a set operational range of input signal intensities. An attenuator is disposed between the optical detector and the signal source. The attenuator is capable of reducing the signal intensity of the optical signal if required so that the optical signal falls within the operational range of the optical detector. A controller is electronically coupled to both the optical detector and the attenuator. The controller controls the attenuator as a function of the output signal of the optical detector, wherein the attenuator attenuates the optical signal to fall within the operational range of the optical detector.
Abstract:
The specification describes a double poly Mechanical Anti-Reflection Switch (MARS) device in which shorting between the lower poly metallization and the silicon substrate is prevented by providing an insulating layer on the surface of the silicon substrate.
Abstract:
In an optical transmitter, an input optical fiber delivers an optical signal to a fiber coupling modulator whose reflective surface is transformable in response to the data to be transmitted. In a first state of the modulator corresponding to a first data value, the reflective surface is flat and smooth. The optical signal, which may be a continuous-wave light, is reflected from the surface and efficiently coupled to an output fiber. In a second state of the modulator corresponding to a second data value, the reflective surface is controllably deformed to cause an aberration in reflecting the optical signal. As a result, a much reduced amount of light energy is coupled to the output fiber.