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公开(公告)号：US10966316B2
公开(公告)日：2021-03-30
申请号：US15767227
申请日：2016-10-14
Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
Inventor： Masao Nakajima , Ichiro Amimori , Osamu Sawanobori , Takao Someya
Abstract: A wiring film is provided between a cloth and an electronic component, wherein the wiring film has a wiring layer including an extensible film and wirings provided along the extensible film inside or on an outer surface of the extensible film and at least a part of the wirings is exposed from a first surface of the wiring layer that faces the electronic component.
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公开(公告)号：US10548219B2
公开(公告)日：2020-01-28
申请号：US15768252
申请日：2016-10-14
Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
Inventor： Masao Nakajima , Ichiro Amimori , Osamu Sawanobori , Takao Someya
Abstract: The present invention provides a stress relaxation substrate for relaxing stress generated due to differences in the hardness of a circuit substrate and a cloth body. This stress relaxation substrate is disposed between a cloth body and a circuit board having a wiring, wherein the stress relaxation substrate includes a stress relaxation layer harder than the cloth body, and softer than the circuit board, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive portion provided on the stress relaxation layer to be formed between a first surface and a second surface.
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公开(公告)号：US20190075652A1
公开(公告)日：2019-03-07
申请号：US15767227
申请日：2016-10-14
Applicant: Japan Science and Technology Agency
Inventor： Masao Nakajima , Ichiro Amimori , Osamu Sawanobori , Takao Someya
Abstract: A wiring film is provided between a cloth and an electronic component, wherein the wiring film has a wiring layer including an extensible film and wirings provided along the extensible film inside or on an outer surface of the extensible film and at least a part of the wirings is exposed from a first surface of the wiring layer that faces the electronic component.
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