公开(公告)号：US10356946B2

公开(公告)日：2019-07-16

申请号：US14407257

申请日：2013-06-06

Applicant: KANEKA CORPORATION

Inventor： Keisuke Oguma ,  Aki Koukami ,  Kazuo Hagiwara

IPC: C08L71/02 ,  C08L33/00 ,  H01L23/42 ,  H05K7/20 ,  H05K9/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/552 ,  B29C73/02 ,  H01L23/29 ,  H01L25/065

Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

公开(公告)号：US20230265252A1

公开(公告)日：2023-08-24

申请号：US18137757

申请日：2023-04-21

Applicant: KANEKA CORPORATION

Inventor： Takahiro Sato ,  Seiji Hosogai ,  Mari Uno ,  Keisuke Oguma

IPC: C08J5/18 ,  C08G73/10

CPC classification number: C08J5/18 ,  C08G73/10 ,  C08J2379/08

Abstract: A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, a 4,4′-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue is A1 mol %, the content ratio of the 4,4′-oxydiphthalic anhydride residue is A2 mol %, the content ratio of the p-phenylenediamine residue is B1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B2 mol %, the relationships of A1+A2≥80, B1+B2≥80 and (A1+B1)/(A2+B2)≤3.50 are satisfied.

公开(公告)号：US11993740B2

公开(公告)日：2024-05-28

申请号：US17508218

申请日：2021-10-22

Applicant: KANEKA CORPORATION

Inventor： Yuichi Imamura ,  Keisuke Oguma ,  Masayoshi Kido

IPC: G02F1/1333 ,  C09K19/02 ,  C09K19/38 ,  C09K19/54 ,  H05K1/02 ,  C08F255/02 ,  C08L51/00

CPC classification number: C09K19/38 ,  C09K19/02 ,  C09K19/542 ,  H05K1/024 ,  C08F255/023 ,  C08L51/003 ,  C09K2219/03 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0183

Abstract: The present disclosure provides a low dielectric resin composition having good melt processability and excellent low dielectric characteristics in a high frequency band as compared to low dielectric materials such as liquid crystal polymers. A molded article and a film, each of which is formed from the low dielectric resin composition, a multilayer film obtained by superposing a metal foil on at least one main surface of the film, and a flexible printed wiring board which includes the film are also provided. The present disclosure includes, as a low dielectric resin composition, a resin composition which contains (A) a liquid crystal polymer and (B) a graft-modified polyolefin having a polar group. The low dielectric resin composition has a dielectric constant of 2.80 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0025 or less at a frequency of 10 GHz.

公开(公告)号：US20150163958A1

公开(公告)日：2015-06-11

申请号：US14407257

申请日：2013-06-06

Applicant: KANEKA CORPORATION

Inventor： Keisuke Oguma ,  Aki Koukami ,  Kazuo Hagiwara

IPC: H05K7/20 ,  C08L71/02 ,  B29C73/02 ,  C08L33/00

CPC classification number: H05K7/2039 ,  B29C73/02 ,  C08L33/00 ,  C08L71/02 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/552 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/16151 ,  H01L2924/16251 ,  H01L2924/166 ,  H01L2924/3025 ,  H05K7/20463 ,  H05K9/0024 ,  H01L2924/00

Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.

Abstract translation: 本发明提供一种散热结构，其不会引起电子部件的接触不良等问题，适用于高密度的电子部件。 本发明还提供一种易于修复电子设备的方法。 通过在其上安装有热密度为0.2W / cm 2至500W / cm 2的电子部件的基板上的电磁屏蔽壳体中填充和固化导热性固化性树脂组合物，获得散热结构， 在23℃下的粘度为30Pa·s〜3000Pa·s，导热率为0.5W /（m·K）的含有固化型液态树脂（I）和导热性填料（II）的树脂组合物， 或更多，并且可通过水分或热量固化。

公开(公告)号：US20240399713A1

公开(公告)日：2024-12-05

申请号：US18802303

申请日：2024-08-13

Applicant: KANEKA CORPORATION

Inventor： Takahiro Sato ,  Keisuke Oguma

IPC: B32B15/08 ,  B32B7/12 ,  B32B37/12 ,  C08G73/10

Abstract: A polyamide acid including tetracarboxylic dianhydride residues and diamine residues is provided. The tetracarboxylic dianhydride residues include a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue and a 3,3′,4,4′-benzophenonetetracarboxylic dianhydride residue. The diamine residues include a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. A multi-layered polyimide film includes a non-thermoplastic polyimide film and an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the non-thermoplastic polyimide film.

公开(公告)号：US09826623B2

公开(公告)日：2017-11-21

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki Koukami ,  Kazuo Hagiwara ,  Keisuke Oguma ,  Kazuhide Fujimoto

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/29 ,  H01L23/373 ,  H05K3/28 ,  H05K1/18 ,  H01L23/31

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.