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公开(公告)号：SG11201901363XA
公开(公告)日：2019-03-28
申请号：SG11201901363X
申请日：2017-06-22
Applicant: KAO CORP
Inventor： IIKUBO RINA , KOBARU SHUICHIRO , KOTAKA YUKI , MARUYAMA AGURI , KAWAGUCHI KOHSUKE
Abstract: The invention relates to a hair treatment method for treating hair by using a hair treatment tool (1). The hair treatment tool (1) includes: a fiber structure member (5) that retains a hair cosmetic; and a liquid-impermeable sheet (3) to which the fiber structure member (5) is fixed. The fiber structure member (5) retains a hair cosmetic that includes a pigment and a film-forming resin, and is sealed in a packaging (2). The hair treatment method of the invention treats hair by: exposing a surface of the fiber structure member (5) of the hair treatment tool (1); and bringing the fiber structure member (5) into contact with hair, and in this state, moving the fiber structure member (5) in a direction of orientation of the hair.
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公开(公告)号：EP2840591A4
公开(公告)日：2016-01-20
申请号：EP13778433
申请日：2013-04-16
Applicant: KAO CORP
Inventor： MIURA JOJI , MATSUI YOSHIAKI , KATO YUKI , KOTAKA YUKI
IPC: H01L21/306 , B24B37/04 , C09G1/02 , C09K3/14 , H01L21/02
CPC classification number: C09G1/02 , B24B37/044 , C09K3/1436 , C09K3/1463 , H01L21/02019 , H01L21/02024 , H01L21/30625
Abstract: A polishing liquid composition for a silicon wafer, wherein the composition comprises silica particles (component A), at least one kind of nitrogen-containing basic compound (component B) selected from an amine compound and an ammonium compound, and a water-soluble macromolecular compound (component C) that contains 10 wt% or more of a constitutional unit I represented by a general formula (1) below and has a weight average molecular weight of 50,000 or more and 1,500,000 or less; and the pH at 25°C is 8.0 to 12.0. In the general formula (1), R 1 and R 2 each independently represents a hydrogen, a C1 to C8 alkyl group, or a C1 to C2 hydroxyalkyl group, and R 1 and R 2 are never both hydrogens.
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