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公开(公告)号：JP2005001019A
公开(公告)日：2005-01-06
申请号：JP2003164329
申请日：2003-06-09
Inventor： OOSHIMA YOSHIAKI , NISHIMOTO KAZUHIKO , SUENAGA KENICHI , HAGIWARA TOSHIYA
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method, a polishing method and a micro waviness reducing method for a substrate which reduce micro waviness of a polished object after polished in finish-polishing a memory hard disk or polishing a semiconductor device. SOLUTION: The substrate manufacturing method uses a polishing fluid composition containing abrasives and water, and a polishing pad having a surface member with an average pore diameter of 0.01-35 μm. The substrate polishing method uses the polishing fluid composition containing the abrasives and water, and the polishing pad having the surface member with the average pore diameter of 0.01-35 μm. The substrate micro waviness reducing method uses: the polishing fluid composition containing the abrasives and water; and the polishing pad having the surface member with the average pore diameter of 0.01-35 μm. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种用于基板的制造方法，抛光方法和微波纹降低方法，其减少抛光后的抛光对象在研磨存储硬盘或抛光半导体器件时的微波纹。 解决方案：基板制造方法使用包含研磨剂和水的抛光液组合物和具有平均孔径为0.01〜35μm的表面构件的研磨垫。 基板研磨方法使用含有研磨剂和水的研磨液组合物和具有平均孔径为0.01〜35μm的表面构件的研磨垫。 底物微波纹降低方法使用：含有研磨剂和水的抛光液组合物; 所述抛光垫具有平均孔径为0.01〜35μm的表面构件。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004204151A
公开(公告)日：2004-07-22
申请号：JP2002377288
申请日：2002-12-26
Inventor： SUENAGA KENICHI , OOSHIMA YOSHIAKI , HAGIWARA TOSHIYA
CPC classification number: C09G1/02 , C09K3/1409 , C09K3/1463
Abstract: PROBLEM TO BE SOLVED: To provide an abrasive liquid composition which enables surface roughness (TMS-Ra) of a substrate of a memory hard drive disk to lower to a sufficient level to practically be used; to provide a lowering method for the surface roughness (TMS-Ra) of the substrate of the memory hard drive disk, using the abrasive liquid composition; and to provide a production method for the substrate of the memory hard drive disk. SOLUTION: The abrasive liquid composition for the substrate of the memory hard disk drive. comprises water and silica particles having a specific molecular size distribution. The method for lowering the surface roughness (TMS-Ra) of the substrate of the memory hard drive disk, involves a process of polishing the substrate, using the liquid composition. The production method for the substrate involves a process of polishing the substrate plated with Ni-P, using the liquid composition. COPYRIGHT: (C)2004,JPO&NCIPI
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公开(公告)号：JP2003211351A
公开(公告)日：2003-07-29
申请号：JP2002005943
申请日：2002-01-15
Applicant: KAO CORP
Inventor： OOSHIMA YOSHIAKI
Abstract: PROBLEM TO BE SOLVED: To provide a method of reducing micro projections of a polishing object substrate capable of economically and highly speedily reducing the surface defect such as a small surface roughness, a projection, and a polishing flaw on a workpiece after polishing, and especially the micro projection detected by a surface shape analysis using an atomic force microscope for finishing polishing of a memory hard disk and polishing for a semiconductor device, to provide a substrate for a magnetic disk obtained by the same method, and to provide manufacturing method for a substrate using the same method. SOLUTION: This method reduces the micro projection of the polishing object substrate detected by the surface analysis using the atomic force microscope (AFM), and has a process of polishing the substrate using polishing liquid composition, which includes water, polishing material, and acid compound, shows acid pH, and has a concentration of the polishing material less than 10 wt.%. The substrate for the magnetic disk is provided by the same method. The method is to manufacture the substrate for the magnetic disk reducing the micro projection detected by the surface analysis using the atomic force microscope (AFM) using the same method. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP2008093819A
公开(公告)日：2008-04-24
申请号：JP2007109721
申请日：2007-04-18
Inventor： OOSHIMA YOSHIAKI , YAMAGUCHI TETSUSHI , DOI AKIHIKO
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition for a magnetic disk substrate capable of reducing surface roughness of the magnetic disk substrate without impairing productivity, and to provide a manufacturing method for a magnetic disk substrate using this. SOLUTION: The polishing liquid composition for the magnetic disk substrate is a polishing liquid composition for a magnetic disk substrate containing water, a silica particle and at least one selected from an acid, a salt of an acid and an oxidizing agent. In the silica particle, a value obtained by dividing an area of a circle making the maximum diameter of the silica particle obtained by measurement by transmission type electronic microscope observation as a diameter by a projection area of the silica particle and multiplying 100 to the obtained value is in a range of 100-130. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供能够降低磁盘基板的表面粗糙度而不损害生产率的用于磁盘基板的抛光液组合物，并提供使用该磁盘基板的磁盘基板的制造方法。 解决方案：用于磁盘衬底的抛光液组合物是含有水，二氧化硅颗粒和选自酸，酸的盐和氧化剂中的至少一种的磁盘衬底的抛光液组合物。 在二氧化硅粒子中，将通过透射型电子显微镜观察得到的测定得到的二氧化硅粒子的最大直径的圆的面积除以二氧化硅粒子的投影面积乘以100而获得的值， 在100-130的范围内。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2007179612A
公开(公告)日：2007-07-12
申请号：JP2005374686
申请日：2005-12-27
Inventor： OOSHIMA YOSHIAKI , YAMAGUCHI TETSUSHI
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition for reducing the waviness of the surface of a substrate, especially the waviness of an outer circumferential part of the surface, and to provide a method of polishing the substrate using the polishing liquid composition. SOLUTION: The polishing liquid composition for a magnetic disk substrate contains silica and a surfactant and has a pH of 0 to 2.5, wherein the surfactant is one or more compounds selected from a group composed of a sulfonic acid compound represented by following general formulae (1) to (3). In the general formula (1) R 1 -(O)n 1 -SO 3 M 1 , R 1 denotes a 3-20C hydrocarbon group, M 1 denotes a hydrogen atom, an inorganic cation or an organic cation and n 1 denotes 0 or 1. In the general formula (2) R 2 OOC-CH 2 -CH(SO 3 M 2 )-COOR 3 , R 2 and R 3 each independently denotes a 3-20C hydrocarbon group and M 2 denotes a hydrogen atom, an inorganic cation or an organic cation. In the general formula (3), R 4 denotes a 3-20C hydrocarbon group and M 3 and M 4 each independently denotes a hydrogen atom, an inorganic cation or an organic cation. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：提供一种用于降低基材表面的波纹的抛光液组合物，特别是表面的外周部分的波纹，并提供使用抛光液研磨基材的方法 组成。 解决方案：用于磁盘衬底的抛光液组合物含有二氧化硅和表面活性剂，其pH为0-2.5，其中表面活性剂是一种或多种选自下列通式表示的磺酸化合物的化合物 式（1）〜（3）。 在通式（1）中，R 1，R 2，R 2，R 3，R 3，R 3，
1 表示3-20C烃基，M 1表示氢原子，无机阳离子或有机阳离子，n 1表示0或 在通式（2）中，R“SP”2 OOC-CH 2 -CH（SO 3 SB 3） ）-COOR 3 ，R 2 和R 3 各自独立地表示3-20C烃基和M 2 表示氢原子，无机阳离子或有机阳离子。 在通式（3）中，R 4 表示3-20C烃基，M 3 和M 4 各自独立地表示氢原子 ，无机阳离子或有机阳离子。 版权所有（C）2007，JPO＆INPIT -
Patent Agency Ranking
公开(公告)号：JP2006130638A
公开(公告)日：2006-05-25
申请号：JP2004325158
申请日：2004-11-09
Inventor： OOSHIMA YOSHIAKI
IPC: B24B37/00 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide an encased abrasive material particle dispersed liquid, remarkably reducing nano-scratch of material to be polished even in polishing after long-term storage independently of the storage period, and also to provide a polishing liquid kit including the encased abrasive material particle dispersed liquid.
SOLUTION: In this encased abrasive material particle dispersed liquid, the ratio of contact liquid area of polishing material particle dispersed liquid to the whole area of the wall surface in the case (contact liquid area)/(total wall surface area in the case) is 0.85 or more. This polishing liquid kit is composed of the encased abrasive material particle dispersed liquid, acid and/or its salt.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：为了提供一种包裹的研磨材料颗粒分散液体，即使在长时间保存后的抛光中，即使在保存期间也能显着降低抛光材料的纳刻划痕，并且还提供抛光液试剂盒 包括包裹的磨料颗粒分散液体。
解决方案：在这种包裹的磨料颗粒分散液中，抛光材料颗粒分散液体的接触液面积与壳体（接触液面积）/（壁面表面积 情况）为0.85以上。 该抛光液体试剂盒由包裹的磨料颗粒分散液，酸和/或其盐组成。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2004204155A
公开(公告)日：2004-07-22
申请号：JP2002377390
申请日：2002-12-26
Inventor： OOSHIMA YOSHIAKI , NISHIMOTO KAZUHIKO , HAGIWARA TOSHIYA
Abstract: PROBLEM TO BE SOLVED: To provide an abrasive liquid composition for markedly reducing micropits on the abraded products after the abrasion work and can attain the economical abrasion that is used for abrasion of substrates of memory hard disks, a method for reducing micropit using the abrasive liquid composion and to provide a method of producing the substrates by using the abrasion liquid composition. SOLUTION: This invention is an abrasive liquid composition in which the content of the silica particles having particle sizes of 5-120 nm in an abrasive material is ≥ 50 vol. %, the content of the small particles having particle sizes of 5-40 nm is 10-70 vol.% on the basis of the total amount of the particles having particle sizes of 5-120 nm in terms of the abrasive material, the content of the middle-sized particles having particle sizes of 40 or more and less than 80 nm is 20-70 vol.% on the basis of the total amount of 5-120 nm and the content of the large particles having particle sizes of 80-120 nm is 0.1-40 vol.% on the basis of the total silica 5-120 nm particles. COPYRIGHT: (C)2004,JPO&NCIPI
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公开(公告)号：JP2002327170A
公开(公告)日：2002-11-15
申请号：JP2001133650
申请日：2001-04-27
Applicant: KAO CORP
Inventor： OOSHIMA YOSHIAKI
IPC: B24B37/00 , C09G1/02 , C09K3/14 , G11B5/84 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To provide a polishing liquid composition low in the surface roughness of a polished material after polishing and moreover capable of polishing at an economical speed without causing a surface defects such as a projection and a polishing flaw for the finish polishing of a memory hard disk or the polishing of a semiconductor device, and method for producing a substrate using the polishing liquid composition and a method polishing the objective substrate by using the polishing liquid composition. SOLUTION: The polishing liquid composition comprising a polishing agent, an oxidizing agent, an organic phosphonic acid as a polishing accelerator and water, the method of production for the substrate having a process polishing the objective polishing substrate by using the polishing liquid composition and the method polishing the objective polishing substrate by using the polishing liquid composition are provided.
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公开(公告)号：JP2002030273A
公开(公告)日：2002-01-31
申请号：JP2000384510
申请日：2000-12-18
Applicant: KAO CORP
Inventor： FUJII SHIGEO , OOSHIMA YOSHIAKI
Abstract: PROBLEM TO BE SOLVED: To provide an abrasive fluid composition which can increase an abrasive speed, lowers the surfaces roughness as well as the roll-off without occurrence of surface defects, a method of grinding the substrate with the composition and a method of producing semiconductor substrates. SOLUTION: This abrasive fluid composition comprises abrasive material, a roll off-reducing agent and alumina wherein the roll off-reducing agent is one or more selected from the group consisting o OH- or SH group having 2-20C carboxylic acids, 1-20C monocarboxylic acids, 2-3C dicarboxylic acids and their salts. In addition, this invention relates to a method of grinding semiconductor substrates by using this grind-finishing fluid composition and a method of producing semiconductor substrates by grinding the substrate with the fluid composition.
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公开(公告)号：JP2002012857A
公开(公告)日：2002-01-15
申请号：JP2000384512
申请日：2000-12-18
Applicant: KAO CORP
Inventor： HAGIWARA TOSHIYA , FUJII SHIGEO , OOSHIMA YOSHIAKI
Abstract: PROBLEM TO BE SOLVED: To obtain a roll-off reducing agent capable of decreasing a roll-off of a substrate to be polished produced by polishing and improving a polishing rate, a roll-off reducing agent composition containing the roll-off reducing agent, to provide a method for decreasing the roll-off of the substrate to be polished by using the roll-off reducing agent and a method for producing the substrate to be polished using the roll-off reducing agent. SOLUTION: This roll-off reducing agent is selected from the group consisting of an OH group or SH group-containing 2-20C carboxylic acid, 1-20C monocarboxylic acid, 2-3C dicarboxylic acid and their salts. This roll-off reducing agent composition comprises the roll-off reducing agent, an abrasive and water. This method for decreasing the roll-off of the substrate to be polished comprises using the roll-off reducing agent. This method for producing the substrate to be polished comprises using the roll-off reducing agent.
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