公开(公告)号：US20150303596A1

公开(公告)日：2015-10-22

申请号：US14388227

申请日：2013-03-07

Applicant: KAYABA INDUSTRY CO., LTD

Inventor： Yuki NAGAI ,  Taroh MATSUMAE

IPC: H01R12/52

CPC classification number: H01R12/523 ,  H01R12/52 ,  H01R12/58 ,  H01R12/73 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10295 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An electronic substrate connecting structure is used to electrically connect a pair of electronic substrates arranged to face each other. The electronic substrate connecting structure includes a plurality of pins erected on one of the electronic substrates to electrically connect the one of the electronic substrates and the other electronic substrate, and a pin guide that has a plurality of guide holes where the pins are inserted and defines positions of the pins such that the pins are connectable to the other electronic substrate while the pins are installed in the one of the electronic substrates.

Abstract translation: 使用电子基板连接结构来电连接彼此相对布置的一对电子基板。 电子基板连接结构包括竖立在电子基板中的一个电子基板上以电连接电子基板和另一个电子基板之间的多个销，以及具有多个引导孔的销引导件，销引脚被插入并限定 销的位置使得当销安装在电子基板之一中时，销可连接到另一电子基板。