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公开(公告)号：US20190390919A1
公开(公告)日：2019-12-26
申请号：US16539848
申请日：2019-08-13
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US20220155025A1
公开(公告)日：2022-05-19
申请号：US17592490
申请日：2022-02-03
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US09921004B2
公开(公告)日：2018-03-20
申请号：US14925787
申请日：2015-10-28
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC classification number: F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US20160161193A1
公开(公告)日：2016-06-09
申请号：US14925787
申请日：2015-10-28
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC classification number: F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
Abstract translation: 本文描述的实施例涉及基于聚合物的热接地平面的概念和设计。 根据一个实施例，使用聚合物作为制造热接地平面的材料。 其他实施方案包括使用两个微柱阵列的优化芯吸结构设计，使用铜/聚合物处理的TGP的基于光刻的微加工，微柱，嵌入微柱中的节流释放孔，原子层沉积（ALD）亲水 涂层，节流流体充填结构和密封方法，无缺陷ALD气密涂层，符合结构设计。
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