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公开(公告)号：US20230332841A1
公开(公告)日：2023-10-19
申请号：US18180122
申请日：2023-03-07
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan John Lewis , Li-Anne Liew , Ching-Yi Lin , Collin Jennings Coolidge , Shanshan Xu , Ronggui Yang , Yung-Cheng Lee
IPC: F28D15/04
CPC classification number: F28D15/046
Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
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公开(公告)号：US10527358B2
公开(公告)日：2020-01-07
申请号：US15292932
申请日：2016-10-13
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ronggui Yang , Yung-Cheng Lee , Victor M. Bright , Chen Li , Christopher Oshman , Bo Shi , Jen-Hau Cheng , George P. Peterson
IPC: F28D15/04 , F28D15/02 , H01L23/367 , H01L23/427 , B23P15/26 , H01L23/473
Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
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公开(公告)号：US20170299277A1
公开(公告)日：2017-10-19
申请号：US15436632
申请日：2017-02-17
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ronggui Yang , Yung-Cheng Lee , Victor M. Bright , Chen Li , Christopher Oshman , Bo Shi , Jen-Hau Cheng , George P. Peterson
IPC: F28D15/02 , B23P15/26 , F28D15/04 , H01L23/473 , H01L23/427 , H01L23/367
Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
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公开(公告)号：US20160161193A1
公开(公告)日：2016-06-09
申请号：US14925787
申请日：2015-10-28
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
CPC classification number: F28D15/046 , B23P15/26 , B81C1/00388 , B81C2201/0108 , C23F4/00 , F28D15/0233 , F28F13/187
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
Abstract translation: 本文描述的实施例涉及基于聚合物的热接地平面的概念和设计。 根据一个实施例，使用聚合物作为制造热接地平面的材料。 其他实施方案包括使用两个微柱阵列的优化芯吸结构设计，使用铜/聚合物处理的TGP的基于光刻的微加工，微柱，嵌入微柱中的节流释放孔，原子层沉积（ALD）亲水 涂层，节流流体充填结构和密封方法，无缺陷ALD气密涂层，符合结构设计。
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公开(公告)号：US20250031347A1
公开(公告)日：2025-01-23
申请号：US18779455
申请日：2024-07-22
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan Lewis , Jason West , Hunter Hach , Hagan Kolanz , Dylan McNally , Ben Hall , Keller Lofgren , Yung-Cheng Lee
Abstract: Three-dimensional meshes and three-dimensional casings for thermal ground planes are disclosed. These three-dimensional meshes and three-dimensional casings can create a vapor core that has structural resiliency positive or negative pressure differential between the vapor space and external conditions. A thermal ground plane is disclosed that includes a first casing that is substantially planar and a second casing. The outer periphery of the first casing and the outer periphery of the second casing are bonded together to form a hermetic seal. The second casing may be deformed to create a vapor support structure within the thermal ground plane that includes a plurality of deformed portions (or rough pillars). A working fluid may be disposed within the first casing and the second casing. Permeable wicks may also be disposed on an inner surface of the first casing and/or the second casing for liquid transport that is disposed between the first casing and the second casing.
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Patent Agency Ranking
公开(公告)号：US20240369306A1
公开(公告)日：2024-11-07
申请号：US18666811
申请日：2024-05-17
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan J. Lewis , Ronggui Yang , Yung-Cheng Lee
IPC: F28D15/02 , F28D15/04 , H01L23/427 , H05K7/20
Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
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公开(公告)号：US11353269B2
公开(公告)日：2022-06-07
申请号：US16680480
申请日：2019-11-11
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ronggui Yang , Yung-Cheng Lee , Victor M. Bright , Chen Li , Christopher Oshman , Bo Shi , Jen-Hau Cheng , George P. Peterson
IPC: F28D15/04 , F28D15/02 , H01L23/367 , H01L23/427 , B23P15/26 , H01L23/473
Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
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公开(公告)号：US20220163268A1
公开(公告)日：2022-05-26
申请号：US17666537
申请日：2022-02-07
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ryan J. Lewis , Ronggui Yang , Yung-Cheng Lee
IPC: F28D15/02 , F28D15/04 , H05K7/20 , H01L23/427
Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
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公开(公告)号：US20220155025A1
公开(公告)日：2022-05-19
申请号：US17592490
申请日：2022-02-03
Applicant: KELVIN THERMAL TECHNOLOGIES, INC.
Inventor： Ryan John Lewis , Yung-Cheng Lee , Li-Anne Liew , Yunda Wang
Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
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公开(公告)号：US10571200B2
公开(公告)日：2020-02-25
申请号：US15436632
申请日：2017-02-17
Applicant: Kelvin Thermal Technologies, Inc.
Inventor： Ronggui Yang , Yung-Cheng Lee , Victor M. Bright , Chen Li , Christopher Oshman , Bo Shi , Jen-Hau Cheng , George P. Peterson
IPC: F28D15/04 , F28D15/02 , H01L23/367 , H01L23/427 , B23P15/26 , H01L23/473
Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
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