公开(公告)号：US20160081200A1

公开(公告)日：2016-03-17

申请号：US14487233

申请日：2014-09-16

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： CHEN-LIN WANG ,  JIUNN-CHENN LU ,  CHIH-CHANG SU

IPC: H05K3/44 ,  H05K3/42

CPC classification number: H05K3/243 ,  H05K3/0017 ,  H05K3/0035 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0588 ,  H05K2203/1572 ,  H05K2203/1581

Abstract: A method for manufacturing circuit board includes steps of forming upper and lower copper foil layers on upper and lower surface of a PI substrate, respectively, etching the upper and lower copper foil layers to form first and second electrical circuits, attaching first and second PI coverlays to the upper and lower copper foil layers, respectively, etching the PI substrate through a PI etching process to form at least one opening exposing the lower copper foil layer, and performing a surface treatment to form a solder layer electrically connected to the electrical circuit of the lower copper foil layer for soldering electrical elements in a subsequent process. Therefore, the circuit board with double side circuit and single side assembly is obtained. The present invention do not employ the process of exposure ink, thereby simplifying the whole manufacturing procedure and greatly improving preciseness of the circuit board.

Abstract translation: 一种制造电路板的方法，包括分别在PI基片的上表面和下表面上形成上，下铜箔层的步骤，蚀刻上下铜箔层，形成第一和第二电路，将第一和第二PI覆盖层 分别向上下铜箔层通过PI蚀刻工艺蚀刻PI衬底以形成暴露下铜箔层的至少一个开口，并进行表面处理以形成电连接到电路的电路的焊料层 用于在后续工艺中焊接电气元件的下部铜箔层。 因此，获得具有双面电路和单面组件的电路板。 本发明不采用曝光油墨的方法，从而简化了整个制造过程并大大提高了电路板的精度。