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公开(公告)号：SG11201402475YA
公开(公告)日：2014-06-27
申请号：SG11201402475Y
申请日：2012-11-28
Applicant: KLA TENCOR CORP
Inventor： CAMPOCHIARO CECILIA , XIAO HONG , VAN RIET MICHAEL , CLARKE BENJAMIN , SINHA HARSH
IPC: H01L21/66
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2.发明公开SYSTEMS AND METHODS FOR PREPARATION OF SAMPLES FOR SUB-SURFACE DEFECT REVIEW 审中-公开系统和样品制备含裂纹的修订表面之下方法
公开(公告)号：EP2789008A4
公开(公告)日：2015-07-22
申请号：EP12852562
申请日：2012-11-28
Applicant: KLA TENCOR CORP
Inventor： CAMPOCHIARO CECILIA , XIAO HONG , VAN RIET MICHAEL , CLARKE BENJAMIN , SINHA HARSH
IPC: H01L21/66
CPC classification number: H01L22/20 , H01J37/28 , H01J37/31 , H01J2237/2817 , H01L22/12
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