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    METHODS AND SYSTEMS FOR DETERMINING A CHARACTERISTIC OF A WAFER
    1.
    发明申请
    METHODS AND SYSTEMS FOR DETERMINING A CHARACTERISTIC OF A WAFER 审中-公开
    用于确定波形特性的方法和系统

    公开(公告)号：WO2007092950A2

    公开(公告)日：2007-08-16

    申请号：PCT/US2007061912

    申请日：2007-02-09

    Applicant: KLA TENCOR TECH CORP ,  KIRK MICHAEL D ,  BEVIS CHRISTOPHER F ,  ADLER DAVID ,  BHASKAR KRIS

    Inventor： KIRK MICHAEL D ,  BEVIS CHRISTOPHER F ,  ADLER DAVID ,  BHASKAR KRIS

    CPC classification number: G01N21/9501 ,  G01N21/4738 ,  G01N21/55

    Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

    Abstract translation: 提供了用于确定晶片特性的方法和系统。 一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出确定晶片的特性。 一个系统包括检查子系统，该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

    METHODS AND SYSTEMS FOR DETERMINING A CHARACTERISTIC OF A WAFER
    3.
    发明专利
    METHODS AND SYSTEMS FOR DETERMINING A CHARACTERISTIC OF A WAFER 未知

    公开(公告)号：SG170805A1

    公开(公告)日：2011-05-30

    申请号：SG2011022597

    申请日：2007-02-09

    Applicant: KLA TENCOR TECH CORP

    Inventor： KIRK MICHAEL D ,  BEVIS CHRISTOPHER F ,  ADLER DAVID ,  BHASKAR KRIS

    Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output. (Figure 5)

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