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    METHODS AND SYSTEMS FOR CONTROLLING VARIATION IN DIMENSIONS OF PATTERNED FEATURES ACROSS A WAFER
    2.
    发明申请
    METHODS AND SYSTEMS FOR CONTROLLING VARIATION IN DIMENSIONS OF PATTERNED FEATURES ACROSS A WAFER 审中-公开
    用于控制WAFER中图案特征尺寸变化的方法和系统

    公开(公告)号：WO2006069255A2

    公开(公告)日：2006-06-29

    申请号：PCT/US2005046636

    申请日：2005-12-20

    Applicant: KLA TENCOR TECH CORP ,  LEVY ADY ,  HANNA MICHAEL ,  WACK DAN ,  FIELDEN JOHN ,  BEVIS CHRISTOPHER F ,  WAGNER LARRY

    Inventor： LEVY ADY ,  HANNA MICHAEL ,  WACK DAN ,  FIELDEN JOHN ,  BEVIS CHRISTOPHER F ,  WAGNER LARRY

    IPC: G06F17/50 ,  G01C25/00 ,  G03C5/00 ,  H01L21/66

    CPC classification number: G03F7/70675 ,  G03F7/38 ,  G03F7/40 ,  G03F7/70425 ,  G03F7/70625

    Abstract: Methods and systems for controlling variation in dimensions of patterned features across a wafer are provided. One method includes measuring a characteristic of a latent image formed in a resist at more than one location across a wafer during a lithography process. The method also includes altering a parameter of the lithography process in response to the characteristic to reduce variation in dimensions of patterned features formed across the wafer by the lithography process. Altering the parameter compensates for non-time varying spatial variation in a temperature to which the wafer is exposed during a post exposure bake step of the lithography process and an additional variation in the post exposure bake step.

    Abstract translation: 提供了用于控制跨晶片的图案化特征的尺寸变化的方法和系统。 一种方法包括在光刻过程期间测量跨越晶片的多于一个位置处的抗蚀剂中形成的潜像的特性。 该方法还包括响应于特性来改变光刻工艺的参数，以减小通过光刻工艺在晶片上形成的图案化特征的尺寸变化。 改变参数补偿在光刻工艺的后曝光烘烤步骤期间晶片曝光的温度中的非时间变化的空间变化和后曝光烘烤步骤的附加变化。

    METHODS AND SYSTEMS FOR DETERMINING A CHARACTERISTIC OF A WAFER
    3.
    发明申请
    METHODS AND SYSTEMS FOR DETERMINING A CHARACTERISTIC OF A WAFER 审中-公开
    用于确定波形特性的方法和系统

    公开(公告)号：WO2007092950A2

    公开(公告)日：2007-08-16

    申请号：PCT/US2007061912

    申请日：2007-02-09

    Applicant: KLA TENCOR TECH CORP ,  KIRK MICHAEL D ,  BEVIS CHRISTOPHER F ,  ADLER DAVID ,  BHASKAR KRIS

    Inventor： KIRK MICHAEL D ,  BEVIS CHRISTOPHER F ,  ADLER DAVID ,  BHASKAR KRIS

    CPC classification number: G01N21/9501 ,  G01N21/4738 ,  G01N21/55

    Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

    Abstract translation: 提供了用于确定晶片特性的方法和系统。 一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出确定晶片的特性。 一个系统包括检查子系统，该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

    SYSTEM AND METHOD FOR CONDUCTING ADAPTIVE FOURIER FILTERING TO DETECT DEFECTS IN DENSE LOGIC AREAS OF AN INSPECTION SURFACE
    4.
    发明申请
    SYSTEM AND METHOD FOR CONDUCTING ADAPTIVE FOURIER FILTERING TO DETECT DEFECTS IN DENSE LOGIC AREAS OF AN INSPECTION SURFACE 审中-公开
    用于检测自适应滤波器以检测检查表面的渗透逻辑区域中的缺陷的系统和方法

    公开(公告)号：WO2007075496A2

    公开(公告)日：2007-07-05

    申请号：PCT/US2006048089

    申请日：2006-12-14

    Applicant: KLA TENCOR TECH CORP ,  MAPOLES EVAN R ,  CHEN GRACE H ,  BEVIS CHRISTOPHER F ,  SHORTT DAVID W

    Inventor： MAPOLES EVAN R ,  CHEN GRACE H ,  BEVIS CHRISTOPHER F ,  SHORTT DAVID W

    IPC: G01N21/88

    CPC classification number: G01N21/95607 ,  G01N21/47 ,  G01N21/95623 ,  G01N2021/8822

    Abstract: A dark field surface inspection tool and system are disclosed herein. The tool includes an illumination source capable of scanning a light beam onto an inspection surface. Light scattered by each inspection point is captured as image data by a photo detector array arranged at a fourier plane. The images captured are adaptively filtered to remove a portion of the bright pixels from the images to generate filtered images. The filtered images are then analyzed to detect defects in the inspection surface. Methods of the invention include using die-to-die comparison to identify bright portions of scattering patterns and generate unique image filters associated with those patterns. The associated images are then filtered to generate filtered images which are then used to detect defects. Also, data models of light scattering behavior can be used to generate filters.

    Abstract translation: 本文公开了一种暗场表面检查工具和系统。 该工具包括能够将光束扫描到检查表面上的照明源。 由每个检查点散射的光通过布置在傅立叶平面上的光检测器阵列捕获为图像数据。 捕获的图像被自适应地滤波以从图像中去除一部分亮像素以产生滤波图像。 然后分析滤波图像以检测检查表面中的缺陷。 本发明的方法包括使用管芯到管芯的比较来识别散射图案的亮部分并且生成与这些图案相关联的独特的图像滤波器。 然后将相关联的图像过滤以产生滤波图像，然后将其用于检测缺陷。 此外，可以使用光散射行为的数据模型来生成滤波器。

    SYSTEMS FOR INSPECTION OF PATTERNED OR UNPATTERNED WAFERS AND OTHER SPECIMEN
    6.
    发明申请
    SYSTEMS FOR INSPECTION OF PATTERNED OR UNPATTERNED WAFERS AND OTHER SPECIMEN 审中-公开
    用于检查图案或未加掩模的其他样本的系统

    公开(公告)号：WO2004111623B1

    公开(公告)日：2005-03-17

    申请号：PCT/US2004017707

    申请日：2004-06-04

    Applicant: KLA TENCOR TECH CORP ,  BEVIS CHRISTOPHER F ,  KIRK MIKE ,  VAEZ-IRAVANI MEHDI

    Inventor： BEVIS CHRISTOPHER F ,  KIRK MIKE ,  VAEZ-IRAVANI MEHDI

    IPC: G01N21/47 ,  G01N21/94 ,  G01N21/95

    CPC classification number: G01N21/956 ,  G01N21/474 ,  G01N21/94 ,  G01N21/9501

    Abstract: Systems for inspection of patterned and unpatterned wafers are provided. One system includes an illumination system configured to illuminate the specimen. The system also includes a collector configured to collect light scattered from the specimen. In addition, the system includes a segmented detector configured to separately detect different portions of the light such that azimuthal and polar angular information about the different portions of light is preserved. The detector may also be configured to produce signals representative of the different portions of the light. The system may also include a processor configured to detect defects on the specimen from the signals. In another embodiment, the system may include a stage that is configured to rotate and translate the specimen. In one such embodiment, the system may also include an illumination system configured to scan the specimen in a wide scan path during rotation and translation of the specimen.

    Abstract translation: 提供了用于图案化和未图案化晶片检查的系统。 一个系统包括被配置为照亮样本的照明系统。 该系统还包括收集器，用于收集从样品散射的光。 此外，该系统包括分段检测器，其被配置为分别检测光的不同部分，使得保持关于光的不同部分的方位角和极坐标信息。 检测器还可以被配置为产生表示光的不同部分的信号。 该系统还可以包括处理器，其配置成从信号中检测样本上的缺陷。 在另一个实施例中，系统可以包括被配置为旋转和平移样本的台。 在一个这样的实施例中，系统还可以包括被配置为在样本的旋转和平移期间以宽扫描路径扫描样本的照明系统。

    DARKFIELD INSPECTION SYSTEM HAVING A PROGRAMMABLE LIGHT SELECTION ARRAY
    7.
    发明申请
    DARKFIELD INSPECTION SYSTEM HAVING A PROGRAMMABLE LIGHT SELECTION ARRAY 审中-公开
    暗场检查系统具有可编程的光选择阵列

    公开(公告)号：WO2005017952A2

    公开(公告)日：2005-02-24

    申请号：PCT/US2004011127

    申请日：2004-04-09

    Applicant: KLA TENCOR TECH CORP ,  BEVIS CHRISTOPHER F ,  SULLIVAN PAUL J ,  SHORTT DAVID W ,  KREN GEORGE J

    Inventor： BEVIS CHRISTOPHER F ,  SULLIVAN PAUL J ,  SHORTT DAVID W ,  KREN GEORGE J

    IPC: G01N21/47 ,  G01N21/88 ,  H01L

    CPC classification number: G01N21/4738 ,  G01N21/8806 ,  G01N2021/8822

    Abstract: An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

    Abstract translation: 检查工具实施例包括用于将光束引导到工件上以产生散射光的照明源，该散射光包括工件的普通散射图案以及从工件的缺陷散射的光。 该实施例包括可编程光选择阵列，其接收从工件散射的光并选择性地将从缺陷散射的光引导到检测缺陷信号的光电传感器上。 处理电路接收缺陷信号并进行工件的表面分析，其可包括表征工件的缺陷。 可编程光选择阵列可以包括但不限于反射器阵列和滤波器阵列。 本发明还包括相关的表面检查方法。

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