公开(公告)号：WO2006104748A1

公开(公告)日：2006-10-05

申请号：PCT/US2006/010042

申请日：2006-03-21

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  LANGE, Steven, R.

Inventor： LANGE, Steven, R.

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G02B17/061 ,  G01N21/9501 ,  G01N2021/9563 ,  G01N2201/0636

Abstract: All-reflective optical systems for broadband wafer inspection are provided. One system configured to inspect a wafer includes an optical subsystem. All light-directing components of the optical subsystem are reflective optical components except for one or more refractive optical components, which are located only in substantially collimated space. The refractive optical component(s) may include, for example, a refractive beamsplitter element that can be used to separate illumination and collection pupils. The optical subsystem may also include one or more reflective optical components located in substantially collimated space. The optical subsystem is configured for inspection of the wafer across a waveband of greater than 20 nm. In some embodiments, the optical subsystem is configured for inspection of the wafer at wavelengths less than and greater than 200 nm.

Abstract translation: 提供了用于宽带晶圆检测的全反射光学系统。 配置为检查晶片的一个系统包括光学子系统。 光学子系统的所有光指向部件都是反射光学部件，除了一个或多个折射光学部件，其仅位于基本准直的空间中。 折射光学部件可以包括例如可用于分离照明和收集瞳孔的折射分束器元件。 光学子系统还可以包括位于基本上准直的空间中的一个或多个反射光学部件。 光学子系统被配置用于跨越超过20nm的波段检查晶片。 在一些实施例中，光学子系统被配置为在小于或大于200nm的波长下检查晶片。

公开(公告)号：WO2003067632A3

公开(公告)日：2003-08-14

申请号：PCT/US2003/003585

申请日：2003-02-05

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： LANGE, Steven, R.

IPC: G02B27/12

Abstract: Techniques for utilizing a microscope inspection system (100) capable of inspecting specimens (112) at high throughput rates are described. The inspection system achieves the higher throughput rates by utilizing more than one detector array (116) and a large field of view to scan the surface of the semiconductor wafers. The microscope inspection system also has high magnification capabilities, a high numerical aperture, and a large field of view. By using more than one detector array, more surface area of a wafer can be inspected during each scanning swath across the semiconductor wafers. The microscope inspection system is configured to have a larger field of view so that the multiple detector arrays can be properly utilized. Additionally, special arrangements of reflective and/or refractive surfaces are used in order to fit the detector arrays within the physical constraints of the inspection system.

公开(公告)号：WO2004092716A1

公开(公告)日：2004-10-28

申请号：PCT/US2004/010324

申请日：2004-04-05

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  LANGE, Steven, R.

Inventor： LANGE, Steven, R.

IPC: G01N21/95

CPC classification number: G01N33/54366 ,  G01N21/9501

Abstract: A surface inspection apparatus and method are disclosed. In particular, the method and apparatus are capable of inspecting a surface in two (or more) optical regimes thereby enhancing the defect detection properties of such method and apparatus. A method involves illuminating the surface with light in a first wavelength range and a second wavelength range. The first wavelength range selected so that the surface is opaque to the light of the first wavelength range so that a resultant optical signal is produced that is predominated by diffractive and scattering properties of the surface. The second wavelength range is selected so that the surface is at least partially transmissive to light in the second wavelength range so that another resultant optical signal is produced that is predominated by thin film optical properties of the surface. The resultant optical signals are detected and processed to detect defects in the surface. Devices for implementing such methods are also disclosed.

Abstract translation: 公开了一种表面检查装置和方法。 特别地，该方法和装置能够在两个（或多个）光学方式中检查表面，从而增强了这种方法和装置的缺陷检测特性。 一种方法包括用在第一波长范围和第二波长范围内的光来照射该表面。 选择的第一波长范围使得表面对于第一波长范围的光是不透明的，使得产生以表面的衍射和散射性质为主的所得光信号。 选择第二波长范围，使得表面对于第二波长范围内的光至少部分透射，从而产生以表面的薄膜光学性质为主的另外产生的光信号。 检测并处理所得到的光信号以检测表面中的缺陷。 还公开了用于实现这些方法的装置。

公开(公告)号：WO2004008111A1

公开(公告)日：2004-01-22

申请号：PCT/US2003/022208

申请日：2003-07-17

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： LANGE, Steven, R.

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/8806

Abstract: The present invention pertains to techniques for increasing the available illumination light, increasing the resolution, and optimizing the spectrum of optical inspection systems (100). These techniques involve combining the light beams (116) from two or more separate illumination sources (104, 114). In one embodiment, this performed by utilizing two separate illumination sources (104, 114 )one of the illumination sources compensates the other illumination source in the wavelength range where illumination light intensity is low. Specifically, this can be performed by utilizing a broadband illumination source (114) and a narrowband illumination source (104) combined with dichroic beamsplitters (106).

Abstract translation: 本发明涉及用于增加可用照明光，提高分辨率和优化光学检查系统（100）的光谱的技术。 这些技术包括组合来自两个或更多个分离的照明源（104,114）的光束（116）。 在一个实施例中，通过利用两个分离的照明源（104,114）来执行这些照明源中的一个，在照明光强度低的波长范围内补偿另一个照明源。 具体地说，这可以通过利用与二向色分束器（106）组合的宽带照明源（114）和窄带照明源（104）来执行。

公开(公告)号：WO2003067632A2

公开(公告)日：2003-08-14

申请号：PCT/US2003/003585

申请日：2003-02-05

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： LANGE, Steven, R.

IPC: H01L

CPC classification number: G02B17/086 ,  G02B17/0808 ,  G02B17/0856 ,  G02B17/0892 ,  G02B21/0016 ,  G02B21/025 ,  G02B21/04 ,  G02B21/18 ,  G02B21/367

Abstract: Techniques for utilizing a microscope inspection system capable of inspecting specimens at high throughput rates are described. The inspection system achieves the higher throughput rates by utilizing more than one detector array and a large field of view to scan the surface of the semiconductor wafers. The microscope inspection system also has high magnification capabilities, a high numerical aperture, and a large field of view. By using more than one detector array, more surface area of a wafer can be inspected during each scanning swath across the semiconductor wafers. The microscope inspection system is configured to have a larger field of view so that the multiple detector arrays can be properly utilized. Additionally, special arrangements of reflective and/or refractive surfaces are used in order to fit the detector arrays within the physical constraints of the inspection system.

Abstract translation: 描述了利用能够以高生产率检查试样的显微镜检查系统的技术。 检查系统通过利用多于一个的检测器阵列和大的视场扫描半导体晶片的表面来实现更高的吞吐率。 显微镜检查系统也具有高放大能力，高数值孔径和大视场。 通过使用多于一个的检测器阵列，可以在横跨半导体晶片的每个扫描条纹期间检查晶片的更多的表面积。 显微镜检查系统被配置为具有更大的视野，使得可以适当地利用多个检测器阵列。 此外，使用反射和/或折射表面的特殊布置，以便将检测器阵列装配在检查系统的物理限制内。

公开(公告)号：EP1481279A2

公开(公告)日：2004-12-01

申请号：EP03715985.2

申请日：2003-02-05

Applicant: KLA-Tencor Technologies Corporation

Inventor： LANGE, Steven, R.

IPC: G02B27/12 ,  G02B21/06 ,  G02B15/14 ,  G02B5/08 ,  G21K7/00

CPC classification number: G02B17/086 ,  G02B17/0808 ,  G02B17/0856 ,  G02B17/0892 ,  G02B21/0016 ,  G02B21/025 ,  G02B21/04 ,  G02B21/18 ,  G02B21/367

Abstract: Techniques for utilizing a microscope inspection system (100) capable of inspecting specimens (112) at high throughput rates are described. The inspection system achieves the higher throughput rates by utilizing more than one detector array (116) and a large field of view to scan the surface of the semiconductor wafers. The microscope inspection system also has high magnification capabilities, a high numerical aperture, and a large field of view. By using more than one detector array, more surface area of a wafer can be inspected during each scanning swath across the semiconductor wafers. The microscope inspection system is configured to have a larger field of view so that the multiple detector arrays can be properly utilized. Additionally, special arrangements of reflective and/or refractive surfaces are used in order to fit the detector arrays within the physical constraints of the inspection system.

公开(公告)号：EP1481279B1

公开(公告)日：2013-06-19

申请号：EP03715985.2

申请日：2003-02-05

Applicant: KLA-Tencor Technologies Corporation

Inventor： LANGE, Steven, R.

IPC: G02B21/00 ,  G02B21/18 ,  G02B17/08 ,  G02B21/36 ,  G02B21/02 ,  G02B17/04 ,  G02B21/04

CPC classification number: G02B17/086 ,  G02B17/0808 ,  G02B17/0856 ,  G02B17/0892 ,  G02B21/0016 ,  G02B21/025 ,  G02B21/04 ,  G02B21/18 ,  G02B21/367

公开(公告)号：EP1869435A1

公开(公告)日：2007-12-26

申请号：EP06739004.7

申请日：2006-03-21

Applicant: KLA-Tencor Technologies Corporation

Inventor： LANGE, Steven, R.

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G02B17/061 ,  G01N21/9501 ,  G01N2021/9563 ,  G01N2201/0636

Abstract: All-reflective optical systems for broadband wafer inspection are provided. One system configured to inspect a wafer includes an optical subsystem. All light-directing components of the optical subsystem are reflective optical components except for one or more refractive optical components, which are located only in substantially collimated space. The refractive optical component(s) may include, for example, a refractive beamsplitter element that can be used to separate illumination and collection pupils. The optical subsystem may also include one or more reflective optical components located in substantially collimated space. The optical subsystem is configured for inspection of the wafer across a waveband of greater than 20 nm. In some embodiments, the optical subsystem is configured for inspection of the wafer at wavelengths less than and greater than 200 nm.

Abstract translation: 提供了用于宽带晶圆检测的全反射光学系统。 配置为检查晶片的一个系统包括光学子系统。 光学子系统的所有光指向部件都是反射光学部件，除了一个或多个折射光学部件，其仅位于基本准直的空间中。 折射光学部件可以包括例如可用于分离照明和收集瞳孔的折射分束器元件。 光学子系统还可以包括位于基本上准直的空间中的一个或多个反射光学部件。 光学子系统被配置用于跨越大于20nm的波段检查晶片。 在一些实施例中，光学子系统被配置为在小于或大于200nm的波长下检查晶片。