公开(公告)号：WO2003036549A1

公开(公告)日：2003-05-01

申请号：PCT/US2002/034219

申请日：2002-10-24

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： SATYA, Akella, V., S. ,  SONG, Li ,  LONG, Robert, Thomas ,  WEINER, Kurt, H.

IPC: G06F19/00

CPC classification number: G01R31/287 ,  G01R31/2831 ,  G01R31/2856 ,  G01R31/2858 ,  G01R31/2894

Abstract: Disclosed are methods and apparatus for determining whether to perform burn-in on a semiconductor product, such as a product wafer or product wafer lot. In general terms, test structures on the semiconductor product are inspected to extract yield information, such as defect densities. Since this yield information is related to the early or extrinsic instantaneous failure rate, one may then determine the instantaneous extrinsic failure rate for one or more failure mechanisms, such as electromigration, gate oxide breakdown, or hot carrier injection, based on this yield information. It is then determined whether to perform bum-in on the semiconductor product based on the determined instantaneous failure rate.

Abstract translation: 公开了用于确定是否对诸如产品晶片或产品晶片批次的半导体产品进行老化的方法和装置。 通常，检查半导体产品上的测试结构以提取诸如缺陷密度的产量信息。 由于该产量信息与早期或非本征瞬时故障率相关，因此可以基于该产量信息来确定一个或多个故障机制的瞬时外在故障率，例如电迁移，栅极氧化物分解或热载流子注入。 然后，基于所确定的瞬时故障率，确定是否对半导体产品进行烧伤。