公开(公告)号：US20180247403A1

公开(公告)日：2018-08-30

申请号：US15963054

申请日：2018-04-25

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G03F1/84 ,  G01N21/956 ,  G03F7/20 ,  G01N21/95

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US11348222B2

公开(公告)日：2022-05-31

申请号：US16677652

申请日：2019-11-07

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G03F7/20 ,  G03F1/84

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US09401014B2

公开(公告)日：2016-07-26

申请号：US14578317

申请日：2014-12-19

Applicant: KLA-Tencor Technologies Corporation

Inventor： Khurram Zafar ,  Sagar Kekare ,  Ellis Chang ,  Allen Park ,  Peter Rose

IPC: G06K9/00 ,  G06T7/00 ,  G03F1/84 ,  G06F17/50

CPC classification number: G06T7/0006 ,  G03F1/84 ,  G06F17/5081 ,  G06T7/0008 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

公开(公告)号：US20150178914A1

公开(公告)日：2015-06-25

申请号：US14639061

申请日：2015-03-04

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/30148

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract translation: 提供了使用设计人员意图数据检查晶圆和标线的方法和系统。 一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。 另一种计算机实现的方法包括通过结合表示标线的数据分析由晶片的检查产生的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。 附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。 进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

公开(公告)号：US10713771B2

公开(公告)日：2020-07-14

申请号：US15963054

申请日：2018-04-25

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G03F7/20 ,  G03F1/84

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US20200074619A1

公开(公告)日：2020-03-05

申请号：US16677652

申请日：2019-11-07

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G03F1/84 ,  G03F7/20 ,  G01N21/956 ,  G01N21/95

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US20150154746A1

公开(公告)日：2015-06-04

申请号：US14578317

申请日：2014-12-19

Applicant: KLA-Tencor Technologies Corporation

Inventor： Khurram Zafar ,  Sagar Kekare ,  Ellis Chang ,  Allen Park ,  Peter Rose

IPC: G06T7/00

CPC classification number: G06T7/0006 ,  G03F1/84 ,  G06F17/5081 ,  G06T7/0008 ,  G06T2207/20076 ,  G06T2207/30148

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

Abstract translation: 提供了与检测数据结合使用设计数据的各种方法和系统。 用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。 该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。 此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。 该方法还包括将合并步骤的结果存储在存储介质中。