公开(公告)号：US20180247403A1

公开(公告)日：2018-08-30

申请号：US15963054

申请日：2018-04-25

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G03F1/84 ,  G01N21/956 ,  G03F7/20 ,  G01N21/95

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US10713771B2

公开(公告)日：2020-07-14

申请号：US15963054

申请日：2018-04-25

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G03F7/20 ,  G03F1/84

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US20200074619A1

公开(公告)日：2020-03-05

申请号：US16677652

申请日：2019-11-07

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G03F1/84 ,  G03F7/20 ,  G01N21/956 ,  G01N21/95

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US11348222B2

公开(公告)日：2022-05-31

申请号：US16677652

申请日：2019-11-07

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G03F7/20 ,  G03F1/84

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

公开(公告)号：US20150178914A1

公开(公告)日：2015-06-25

申请号：US14639061

申请日：2015-03-04

Applicant: KLA-Tencor Technologies Corporation

Inventor： Paul Frank Marella ,  Sharon McCauley ,  Ellis Chang ,  William Volk ,  James Wiley ,  Sterling Watson ,  Sagar A. Kekare ,  Carl Hess

IPC: G06T7/00

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/30148

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract translation: 提供了使用设计人员意图数据检查晶圆和标线的方法和系统。 一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。 另一种计算机实现的方法包括通过结合表示标线的数据分析由晶片的检查产生的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。 附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。 进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。