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公开(公告)号：US20230099375A1
公开(公告)日：2023-03-30
申请号：US18075408
申请日：2022-12-05
Applicant: KMW INC.
Inventor： Duk Yong KIM , Kyo Sung JI , Chi Back RYU , Kyu Chul CHOI , Hye Yeon KIM , In Hwa CHOI , Jae Ho JANG , Jae Hyun PARK , Youn Jun CHO , Jeong Hyun CHOI
IPC: H01Q1/02 , H01Q1/24 , H04B7/0413
Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit.
The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.-
公开(公告)号：US20220377941A1
公开(公告)日：2022-11-24
申请号：US17881653
申请日：2022-08-05
Applicant: KMW INC.
Inventor： Kyo Sung JI , Bae Mook JEONG , In Hwa CHOI
Abstract: Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present invention, comprises: a heat dissipating housing having an internal space; a shield case formed of a thermally conductive material, wherein the shield case is disposed in the heat dissipating housing and partitions the internal space into a first chamber which is a vacuum space to be filled with a refrigerant and a second chamber which is a non-vacuum space; and a printed circuit board which is disposed in the shield case and has a heat dissipating element. The shield case evaporates the refrigerant by using sensible heat transferred from the heat dissipating element to the shield case and latent heat transferred from the shield case to the first chamber.
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公开(公告)号：US20250151234A1
公开(公告)日：2025-05-08
申请号：US19017425
申请日：2025-01-11
Applicant: KMW INC.
Inventor： Hwang Ju LEE , Dong Won KIM , Jae Ho JANG , Kang Hyun LEE , In Hwa CHOI
IPC: H05K7/20
Abstract: Provided according to an embodiment of the present disclosure is a heating element cooling device comprising: a body part including a hollow portion in which working fluid is circulated and a wick portion which is disposed in at least a part of an inner wall of the body part and through which the working fluid flows to a heat source; a space part formed to extend from each of both ends of the body part and including a hollow portion; and a block part inserted into and welded to the space part.
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Patent Agency Ranking
公开(公告)号：US20230021186A1
公开(公告)日：2023-01-19
申请号：US17947127
申请日：2022-09-18
Applicant: KMW INC.
Inventor： Duk Yong KIM , Jin Soo YEO , Kyu Chul CHOI , In Hwa CHOI , Youn Jun CHO , Jeong Hyun CHOI , Jae Hyun PARK
Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.
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公开(公告)号：US20240251527A1
公开(公告)日：2024-07-25
申请号：US18405314
申请日：2024-01-05
Applicant: KMW INC.
Inventor： Duk Yong KIM , Dong Won KIM , Hye Yeon KIM , Jun Woo YANG , Chi Back RYU , Kyo Sung JI , In Hwa CHOI
CPC classification number: H05K7/20418 , H05K7/2029 , H01Q1/02
Abstract: The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and the active heat dissipation apparatus includes a thermal conduction panel body having a refrigerant flow space configured to provide a space in which gas-liquid circulation is performed so that a refrigerant dissipates heat while changing phases in a closed space having an interior filled with the refrigerant, in which the refrigerant flow space includes a first refrigerant flow path that is a vaporization zone in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a second refrigerant flow path configured to serve as a route through which a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, flows toward the first refrigerant flow path by surface tension or gravity.
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公开(公告)号：US20220354018A1
公开(公告)日：2022-11-03
申请号：US17864424
申请日：2022-07-14
Applicant: KMW INC.
Inventor： Duk Yong KIM , Jin Soo YEO , Kyu Chul CHOI , In Hwa CHOI , Youn Jun CHO , Jeong Hyun CHOI , Jae Hyun PARK
Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size. To this end, the cooling apparatus for an electronic element according to the present invention includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit, by using sensible heat transferred from the first chamber to the evaporation unit and latent heat transferred from the evaporation unit to the second chamber.
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公开(公告)号：US20250098117A1
公开(公告)日：2025-03-20
申请号：US18964447
申请日：2024-12-01
Applicant: KMW INC.
Inventor： Duk Yong KIM , Kyo Sung JI , Dong Won KIM , Kyu Tae HAN , Hwang Ju LEE , In Hwa CHOI
IPC: H05K7/20
Abstract: The present invention relates to a heat sink structure and a manufacturing method thereof, in which a plurality of heat radiation fin parts, which is configured to radiate heat, is fixed to a heat radiation surface of a heat sink main body part by laser welding, such that thicknesses of and intervals between the plurality of heat radiation fin parts may be minimized, heat dissipation performance may be improved, a weight may be greatly reduced, and production lead time and manufacturing costs may be significantly reduced by manufacturing only the heat sink main body part by casting.
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公开(公告)号：US20230047942A1
公开(公告)日：2023-02-16
申请号：US17975621
申请日：2022-10-28
Applicant: KMW INC.
Inventor： Duk Yong KIM , Kyu Chul CHOI , In Hwa CHOI , Youn Jun CHO , Jae Hyun PARK , Kyo Sung JI , Hye Yeon KIM , Chi Back RYU , Jeong Hyun CHOI , Jae Ho JANG
Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.
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