公开(公告)号：US20220354018A1

公开(公告)日：2022-11-03

申请号：US17864424

申请日：2022-07-14

Applicant: KMW INC.

Inventor： Duk Yong KIM ,  Jin Soo YEO ,  Kyu Chul CHOI ,  In Hwa CHOI ,  Youn Jun CHO ,  Jeong Hyun CHOI ,  Jae Hyun PARK

IPC: H05K7/20 ,  H01Q1/02 ,  H01Q1/42

Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size. To this end, the cooling apparatus for an electronic element according to the present invention includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit, by using sensible heat transferred from the first chamber to the evaporation unit and latent heat transferred from the evaporation unit to the second chamber.

公开(公告)号：US20230047942A1

公开(公告)日：2023-02-16

申请号：US17975621

申请日：2022-10-28

Applicant: KMW INC.

Inventor： Duk Yong KIM ,  Kyu Chul CHOI ,  In Hwa CHOI ,  Youn Jun CHO ,  Jae Hyun PARK ,  Kyo Sung JI ,  Hye Yeon KIM ,  Chi Back RYU ,  Jeong Hyun CHOI ,  Jae Ho JANG

IPC: H01Q1/02 ,  H01Q1/24

Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.

公开(公告)号：US20230099375A1

公开(公告)日：2023-03-30

申请号：US18075408

申请日：2022-12-05

Applicant: KMW INC.

Inventor： Duk Yong KIM ,  Kyo Sung JI ,  Chi Back RYU ,  Kyu Chul CHOI ,  Hye Yeon KIM ,  In Hwa CHOI ,  Jae Ho JANG ,  Jae Hyun PARK ,  Youn Jun CHO ,  Jeong Hyun CHOI

IPC: H01Q1/02 ,  H01Q1/24 ,  H04B7/0413

Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit.
The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

公开(公告)号：US20230021186A1

公开(公告)日：2023-01-19

申请号：US17947127

申请日：2022-09-18

Applicant: KMW INC.

Inventor： Duk Yong KIM ,  Jin Soo YEO ,  Kyu Chul CHOI ,  In Hwa CHOI ,  Youn Jun CHO ,  Jeong Hyun CHOI ,  Jae Hyun PARK

IPC: H05K7/20 ,  H05K1/02 ,  H01Q1/02 ,  H01Q1/42

Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.