Abstract:
In order to inspect a board, first, a board prior to mounting an element on the board by a mounter is transferred to a work stage. Then, warpage of the board is inspected. Thereafter, in case that the board is judged good as a result of the inspection, the board is transferred to the mounter, and in case that the board is judged no good as the result of the inspection, the board is finally determined no good without transferring the board to the mounter. Thus, unnecessary works and defective products may be prevented beforehand, and productivity and efficiency of inspection may be increased.
Abstract:
In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.