公开(公告)号：US3629185A

公开(公告)日：1971-12-21

申请号：US3629185D

申请日：1969-10-17

Applicant: KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD JOHN ,  MCCORMACK JOHN FRANCIS

IPC: B01J31/08 ,  B01J31/30 ,  B01J47/00 ,  C08K3/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42 ,  C08G51/04

CPC classification number: B01J31/30 ,  B01J31/08 ,  B01J47/016 ,  C08K3/013 ,  C23C18/1608 ,  H05K1/0373 ,  H05K3/28 ,  H05K3/422 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/09436 ,  C08L67/06

Abstract: THERE ARE PROVIDED MOLDING COMPOSITIONS COMPRISING PARTICLES OF RESIN HAVING INCORPORATED THEREWITH FILLERS CATALYTIC TO THE DEPOSITION OF ELECTROLESS METALS. THE CATALYTIC FILLERS ARE MADE BY REPLACING THE CATIONS IN PARTICULATE BASE EXCHANGEABLE MATERIALS WITH A CATION OF A METAL SELECTED FROM GROUPS 1 B AND 8 OF THE PERIODIC TABLE OF ELEMENTS. ARTICLES MOLDED FROM THE COMPOSITIONS AND THE WALLS OF HOLES DRILLED IN THEM ARE METALLIZED ON BEING IMMERSED IN ELECTROLESS METAL DEPOSITION BATHS.

公开(公告)号：US3546009A

公开(公告)日：1970-12-08

申请号：US3546009D

申请日：1967-01-03

Applicant: KOLLMORGEN CORP

Inventor： SCHNEBLE FREDERICK W JR ,  LEECH EDWARD JOHN ,  MCCORMACK JOHN FRANCIS

IPC: B01J37/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/40 ,  D06Q1/04 ,  H05K1/03 ,  H05K3/18 ,  H05K3/42 ,  B44D1/14 ,  B44D1/34

CPC classification number: H05K3/422 ,  B01J37/00 ,  C23C18/1608 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40 ,  D06Q1/04 ,  H05K1/0373 ,  H05K3/181 ,  H05K3/427 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0236 ,  Y10T428/24322 ,  Y10T428/31678

公开(公告)号：AU4490672A

公开(公告)日：1974-01-31

申请号：AU4490672

申请日：1972-07-24

Applicant: KOLLMORGEN CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD JOHN

IPC: G03C1/64 ,  G03F7/004 ,  H05K3/18 ,  H05K3/42 ,  H05K3/10

公开(公告)号：AU4146372A

公开(公告)日：1973-10-25

申请号：AU4146372

申请日：1972-04-21

Applicant: KOLLMORGEN CORP

Inventor： LEECH EDWARD JOHN

IPC: G03F7/40 ,  B44C1/04 ,  C25D7/00 ,  G03C5/58 ,  G03F7/09 ,  G03F7/26 ,  G12B11/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  G03C1/68 ,  G03C1/72 ,  G03C1/76 ,  G03F7/10

公开(公告)号：AU615792B2

公开(公告)日：1991-10-10

申请号：AU4129089

申请日：1989-09-12

Applicant: KOLLMORGEN CORP

Inventor： JOHNSON STEVEN MARTIN ,  LEECH EDWARD JOHN

IPC: G03F7/26 ,  H05K3/28 ,  G03C1/727

公开(公告)号：BR8904585A

公开(公告)日：1990-04-24

申请号：BR8904585

申请日：1989-09-12

Applicant: KOLLMORGEN CORP ,  HAVEN CORP

Inventor： LEECH EDWARD JOHN ,  JOHNSON STEVEN MARTIN

IPC: C08F2/46 ,  C08F2/48 ,  C08G59/00 ,  C08G59/18 ,  G03F7/027 ,  G03F7/032 ,  G03F7/075 ,  H05K3/18 ,  H05K3/28 ,  C08J7/18 ,  C08L63/00

Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder masks for printed circuits and permanent plating resists for additive printed wiring boards. The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.

公开(公告)号：DE3930586A1

公开(公告)日：1990-03-22

申请号：DE3930586

申请日：1989-09-13

Applicant: KOLLMORGEN CORP

Inventor： LEECH EDWARD JOHN ,  JOHNSON STEVEN MARTIN

IPC: C08F2/46 ,  C08F2/48 ,  C08G59/00 ,  C08G59/18 ,  G03F7/027 ,  G03F7/032 ,  G03F7/075 ,  H05K3/18 ,  H05K3/28

Abstract: Compositions which include an acidified epoxy oligomer, a free radical photoinitiator and a monomer capable of being polymerized by the photoinitiator are used to form aqueous developable, photodefined coatings useful as permanent solder masks for printed circuits and permanent plating resists for additive printed wiring boards. The process for using the compositions include application as a fluid in solvents; drying; exposing to ultraviolet light; developing in an aqueous alkaline solution; and crosslinking the acidified, epoxy oligomers. The articles produced include printed wiring boards with the permanent, photoimaged resist composition thereon.

公开(公告)号：AU5226273A

公开(公告)日：1974-08-22

申请号：AU5226273

申请日：1973-02-16

Applicant: KOLLMORGEN CORP

Inventor： LEECH EDWARD JOHN ,  MCCORMACK JOHN FRANCIS ,  SCHNEBLE FREDERICK WILLIAM JR ,  ZEBLISKY RUDOLPH JOHN

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/24 ,  C23C18/26 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  H05K3/18 ,  H05K3/38 ,  H05K3/10 ,  C23C3/02

公开(公告)号：AU4502172A

公开(公告)日：1974-01-31

申请号：AU4502172

申请日：1972-07-26

Applicant: KOLLMORGEN CORP

Inventor： POLICHETTE JOSEPH ,  LEECH EDWARD JOHN ,  NUZZI FRANCIS JOSEPH

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/26 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38 ,  B41M5/26

Abstract: There are provided new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., or chemical reducing agents is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.