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    2.
    发明专利
    未知

    公开(公告)号：DE3624629A1

    公开(公告)日：1987-02-05

    申请号：DE3624629

    申请日：1986-07-18

    Applicant: KOLLMORGEN TECH CORP

    Inventor： SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

    IPC: C09J201/00 ,  C08G18/79 ,  C08G59/18 ,  C08G59/40 ,  C09J163/00 ,  C09J167/00 ,  C09J175/00 ,  C09J175/04 ,  H05K3/10 ,  H05K3/38 ,  C09J3/16 ,  C09J5/06

    Abstract: A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ating a reactio n with the functional groups of the poly­meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­vate the adhesive composition, said curing agent being pre­sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­tion is suitable for bonding wire to a surface, to another wire or to itself.

    HEAT ACTIVATABLE ADHESIVES
    4.
    发明专利
    HEAT ACTIVATABLE ADHESIVES 未知

    公开(公告)号：GB2178750A

    公开(公告)日：1987-02-18

    申请号：GB8617366

    申请日：1986-07-16

    Applicant: KOLLMORGEN TECH CORP

    Inventor： SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

    IPC: C09J201/00 ,  C08G18/79 ,  C08G59/18 ,  C08G59/40 ,  C09J163/00 ,  C09J167/00 ,  C09J175/00 ,  C09J175/04 ,  H05K3/10 ,  H05K3/38 ,  C09J3/00 ,  C08L63/00 ,  C08L67/00 ,  C08L75/04 ,  C09J3/14 ,  C09J3/16 ,  C09J5/06

    Abstract: A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ating a reactio n with the functional groups of the poly­meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­vate the adhesive composition, said curing agent being pre­sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­tion is suitable for bonding wire to a surface, to another wire or to itself.

    7.
    发明专利
    未知

    公开(公告)号：FR2585028B1

    公开(公告)日：1989-04-07

    申请号：FR8609787

    申请日：1986-07-04

    Applicant: KOLLMORGEN TECH CORP

    Inventor： SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

    IPC: C09J201/00 ,  C08G18/79 ,  C08G59/18 ,  C08G59/40 ,  C09J163/00 ,  C09J167/00 ,  C09J175/00 ,  C09J175/04 ,  H05K3/10 ,  H05K3/38 ,  C09J3/16

    Abstract: A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultra­sonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, poly­urethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second com­ponent being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initi­ating a reactio n with the functional groups of the poly­meric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will acti­vate the adhesive composition, said curing agent being pre­sent in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composi­tion is suitable for bonding wire to a surface, to another wire or to itself.

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