公开(公告)号：GB2180696B

公开(公告)日：1989-07-19

申请号：GB8617363

申请日：1986-07-16

Applicant: KOLLMORGEN TECH CORP

Inventor： SWIGGETT BRIAN EDWARD ,  MORINO RONALD ,  KEOGH RAYMOND J ,  SZENCZY GEORGE ,  CROWELL JONATHAN CLARK ,  SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

IPC: H05K3/10 ,  H05K3/46 ,  H05K3/22 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

公开(公告)号：AU594352B2

公开(公告)日：1990-03-08

申请号：AU6035386

申请日：1986-07-18

Applicant: KOLLMORGEN TECH CORP

Inventor： SWIGGETT BRIAN EDWARD ,  MORINO RONALD ,  KEOGH RAYMOND J ,  CROWELL JONATHAN CLARK ,  SZENCZY GEORGE ,  SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/22 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06 ,  H05K1/11 ,  C08G81/00 ,  C08G81/02 ,  C08F283/00 ,  C08F283/10 ,  C09J3/14

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

公开(公告)号：FR2585209A1

公开(公告)日：1987-01-23

申请号：FR8609789

申请日：1986-07-04

Applicant: KOLLMORGEN TECH CORP

Inventor： SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE ,  SWIGGETT BRAAN EDWARD ,  MORINO RONALD ,  CROWELL JONATHAN CLARK ,  SZENCZY GEORGE ,  KEOGH RAYMOND J

IPC: H05K3/10 ,  H05K3/22 ,  H05K3/38 ,  H05K3/46 ,  H05K3/42 ,  H05K7/06 ,  G02B6/12

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

公开(公告)号：GB2180696A

公开(公告)日：1987-04-01

申请号：GB8617363

申请日：1986-07-16

Applicant: KOLLMORGEN TECH CORP

Inventor： SWIGGETT BRIAN EDWARD ,  MORINO RONALD ,  KEOGH RAYMOND J ,  SZENCZY GEORGE ,  CROWELL JONATHAN CLARK ,  SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

IPC: H05K3/10 ,  H05K3/46 ,  H05K3/22 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

公开(公告)号：DE3624627A1

公开(公告)日：1987-01-29

申请号：DE3624627

申请日：1986-07-18

Applicant: KOLLMORGEN TECH CORP

Inventor： MORINO RONALD ,  SWIGGETT BRIAN EDWARD ,  KEOGH RAYMOND J ,  CROWELL JONATHAN CLARK ,  SZENCZY GEORGE ,  SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/22 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06 ,  B23K26/00 ,  H05K3/34 ,  H02G1/12 ,  H01B3/30

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.

公开(公告)号：CA1251576A

公开(公告)日：1989-03-21

申请号：CA514114

申请日：1986-07-18

Applicant: KOLLMORGEN TECH CORP

Inventor： SWIGGETT BRIAN E ,  MORINO RONALD ,  KEOGH RAYMOND J ,  CROWELL JONATHAN C ,  SZENCZY GEORGE ,  SCHOENBERG ANDREW J ,  FRIEDRICH MARJU L

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/22 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06

Abstract: This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.

公开(公告)号：AU6035386A

公开(公告)日：1987-01-22

申请号：AU6035386

申请日：1986-07-18

Applicant: KOLLMORGEN TECH CORP

Inventor： SWIGGETT BRIAN EDWARD ,  MORINO RONALD ,  KEOGH RAYMOND J ,  CROWELL JONATHAN CLARK ,  SZENCZY GEORGE ,  SCHOENBERG ANDREW JED ,  FRIEDRICH MARJU LAUBE

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/22 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06 ,  H05K1/11 ,  C08G81/00 ,  C08G81/02 ,  C08F283/00 ,  C08F283/10 ,  C09J3/14

Abstract: In a process for scribing conductors in a predetermined pattern onto a surface of a substrate being adhesive coated, the adhesive coating being non-tacky and solid before activation and activatable by application of energy which may be applied by means of a pulsed radiation or heated fluid beam, and revert to the non-tacky, solid state after activation.