公开(公告)号：WO1988003180A1

公开(公告)日：1988-05-05

申请号：PCT/US1987002854

申请日：1987-10-30

Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION

Inventor： KOLLMORGEN TECHNOLOGIES CORPORATION ,  DUFFY, John ,  PAUNOVIC, Milan ,  CHRISTIAN, Steven, M. ,  McCORMACK, John, F.

IPC: C23C18/34

CPC classification number: C23C18/1675 ,  C23C18/1683

Abstract: Method for analyzing an electroless plating solution which comprises metallic ions and reducing agent for the metallic ion, the method comprising providing at least two electrodes in the plating solution, electrochemically analyzing at least one constituent of the plating solution using the electrodes, and providing a reproducible surface on at least one of the electrodes after the analysis by electrochemically stripping and resurfacing in the plating solution in order to prepare for the next analysis cycle.