Abstract:
PURPOSE: A growth method of GaN on an SI by modulating a source flux are provided to grow a second GaN layer without a crack by inserting an AlGaN layer between an AlN buffer layer and a first GaN layer as a buffer layer. CONSTITUTION: A metal N compound of an N saturation is deposited in a substrate to form a first metal N compound layer. The metal N compound is deposited in the first metal N compound layer to form a second metal N compound layer. A GaN of N saturation is deposited on a second metal N compound layer to form a first GaN layer. A GaN of Ga saturation is deposited in the first GaN layer to form a second GaN layer.
Abstract:
PURPOSE: A method for manufacturing a nitride based semiconductor device including a floated gate electrode is provided to improve operation speed of a nitride based semiconductor device by reducing parasitic capacitance due to high dielectric constant of a protective layer. CONSTITUTION: An epilayer(20,30,40) is formed on a base substrate(10). A source electrode(61) and a drain electrode(63) are formed on the epilayer at regular intervals. A protective layer(70) is formed for covering the epilayer. A gate contact hole(76) is formed between the source electrode and the drain electrode. The gate electrode(65) includes an electrode unit floated on a connection unit and the protective layer.
Abstract:
PURPOSE: A substrate holder for a molecular beam epitaxy apparatus is provided to reduce unevenness of a thermal expansion coefficient and processing temperature of a substrate, thereby minimizing crack generation within the substrate in a high temperature heating process. CONSTITUTION: A substrate holder(10') is formed into a tube shape which is opened in up and down directions. A protrusion(11) is arranged along the circumference in the inner surface of the substrate holder in order to horizontally mount an epitaxy target substrate(D). A plurality of supporting projections(12) is arranged in the upper surface of the protrusion in order to separate the substrate from the protrusion. A step shape groove is arranged in the inner upper part of the substrate holder. The substrate holder is manufactured with pure molybdenum or molybdenum alloy.
Abstract:
PURPOSE: A transistor having a heat dissipation structure is provided to effectively radiate heat generated from an electrode to the outside. CONSTITUTION: A substrate(10) has a front side and a back side. Multiple nitride layers(12, 14, 16, 18, 19) are formed on the front side of the substrate. A source electrode(31), a gate electrode(33) and a drain electrode(35) are formed on the multiple nitride layers. A heat radiation structure includes a cooling groove and a radiation layer(43). The cooling groove is formed on the back side of the substrate so that the substrate includes an area in which a plurality of electrodes is formed. The radiation layer is formed on the inner side of the cooling groove.