Abstract:
A method for fabricating an optical multi-layer thin film is provided to implement multi-band transmission filter having a wanted transmission band by precisely controlling the thickness of a Non-QWOT(Quater Wave Optical Thickness) stack layer through a QWOT stack structure layer and a thin film thickness control layer. A method for fabricating an optical multi-layer thin film includes the steps of: forming a QWOT stack structure layer in which material layers of different refractive indexes are alternatively stacked on a substrate in the thickness of QWOT(S11); forming a Non-QWOT stack structure layer in which material layers of different refractive indexes are alternatively stacked in the thickness of Non-QWOT on the QWOT stack structure layer(S12); forming a thin film thickness control layer having the thickness of an integer multiple which is larger than two times of the QWOT(S13); and forming the Non-QWOT stack structure layer on the upper part of the thin film thickness control layer(S14).
Abstract:
An apparatus and a method for polishing a partial section of an optical wave guide of an optical printed circuit board are provided to achieve improved quality of the optical wave guide by sequentially replacing wheels equipped with polishing pads. An apparatus(100) for polishing a partial section of an optical wave guide of an optical printed circuit board includes a motor(110), a wheel(120), a substrate mounting frame(130), a second rotating shaft(140), and a cam(150). The motor rotates a first rotating shaft(112). The wheel has one surface on which a polishing pad(121) is attached and the other surface coupled to a front end of the first rotating shaft. The substrate mounting frame has a surface mounted with an optical printed circuit board having a groove or a hole for exposing the partial section of the optical wave guide. The second rotating shaft is coupled onto the motor such that the second rotating shaft interlocks with the first rotating shaft. The cam is coupled to the second rotating shaft such that the substrate mounting frame horizontally reciprocates on the polishing pad.
Abstract:
The present invention provides a photoelectric conversion module capable of increasing the optical coupling efficiency by horizontally arranging an optical device and a wave guide in order to reduce optical loss. According to the present invention, the photoelectric conversion module comprises: a printed circuit board; an integrated circuit board, which is mounted in the upper part of the printed circuit board, formed with a wave guide array that is pierced from one side portion to the other side portion inside, and formed with 1st and 2nd electrode pads on one side wall; an optical device array which is formed with 1st and 2nd electrode bumps respectively connected to the 1st and 2nd electrode pads on one side wall that is opposed to the integrated circuit board, and equipped with an optical device in the central part; and a semiconductor chip mounted on the integrated circuit board.